New markets LED lighting to high thermal conductive substrate
The rapid rise of white LED lighting, no matter in the market or on the manufacturing technology, showed a rapid development momentum. At the same time, the industry has LED to a new generation of LED with the rise and development of material technology, used in LED heat conduction base board is one of them. As well as high thermal conductive substrate material industry opens up new market space.
Heat conduction base board market is huge
Thermal conductive substrate is playing an increasingly important role in the LED heat dissipation, and create a new market opportunity.
LED due to possess the characteristics of environmental protection and energy saving, rapid development in the areas of lighting, as a kind of photoelectric device and its working principle is actually a photoelectric conversion process, the input part of electricity will be converted into light energy, can be used for lighting. But, the rest of the electricity will be converted into heat energy, the heat will lead to raise the temperature of the LED chip. And the impact of temperature rise of the LED chip is very big, will make the LED luminous efficiency is reduced, greatly shorten the service life, etc. So how to realize the effective heat dissipation become LED manufacturers the most concern. Fang Zhilie, fudan university professor pointed out that LED thermal management including chip, encapsulation, and system and so on multiple levels. Chip level, people can through increase of the chip itself internal and external quantum efficiency, strengthen the LED chip light conversion rate, reduce heat generation. Generally LED encapsulation link can use metal substrates, ceramic substrates such as thermal conductive substrate accelerated cooling.
LED output power is higher and higher in recent years, the application scope of more than 1 w high power LED is more and more big, the heat dissipation problem as related industry development targets, the role of thermal conductive substrate in LED heat dissipation is becoming more and more important, but also create an important market opportunities. According to PIDA photoelectric (Taiwan association for the advancement of science, technology and industry) investigation statistics, the global LED heat conduction base board market sales of about $855 million in 2010. Four years from 2009 to 2012, global sales LED heat conducting substrate average growth rate of 30.02%.
Looking ceramic and resin substrate
Higher thermal conductivity, stronger application flexibility and better performance/cost ratio, is the LED the main development direction of thermal conductive substrate.
Thermal conductive substrate cooling is an important part of LED thermal management technology, its technological development trend under the influence of LED market application requirements. In general, the higher thermal conductivity, stronger application flexibility and better performance/cost ratio is the main development direction of current.
High power LED is the mainstream of the current lighting market application. But because of its calorific value is bigger, request heat conducting substrate material must have a higher thermal conductivity, heat resistance and stability. , xin swimming sen photoelectric (shenzhen) co., LTD., general manager of badad Ming told reporters that the current LED heat conduction base board basically divided into the printing substrate (PCB), metal and ceramic substrates such as several major categories. Generally low power LED the calorific value is not big, heat dissipation problems is not serious, so as long as the exercise of ordinary PCB can meet the demand.
But with high power LED is more and more popular, the PCB is not enough to cope with the cooling demand, printed circuit board must be attached with a on a metal plate, in order to improve the heat transfer path. Metal substrate with aluminum or copper materials. Due to the mature technology, and has cost advantages, the current for the LED lighting products are widely used. However, as people pursuit of higher heat efficiency, better heat dissipation performance of ceramic substrates was also developed, and have been increasingly used in practice. AIN ceramic substrate, the thermal conductivity is higher, about 170 ~ 240 w/m K, thermal expansion coefficient is 3.5 ~ 5 PPM/K. "But the cost of materials and processing molding cost is very high, so the price is more expensive, such as the mass purchase will not be suitable for the application." Badad Ming said.
LED packaging not only requires to protect the LED chip, also can be pervious to light, should also consider link module and application of special design requirements, so the future LED to the encapsulation material flexibility will become more and more demanding. Thermal conductive substrate enterprise also pay more and more attention to this aspect demand. Such as panasonic electrician, in the development of the LED heat conduction base board will strive to develop both high thermal conductivity and flexibility of organic resin substrate materials. Panasonic electrician to market in January 2009, a high thermal conductivity of glass fiber cloth - organic resin composite base copper clad "EcooLR - 1787". The thermal conductivity of the product for 1 W/m K, thermal resistance is 6.7 / W. In January 2012 in the lighting show in Tokyo, panasonic and shows a new generation of EcooLR - 1586.
According to the panasonic electric NL sales's field by the introduction of pears, EcooLR - 1586 thermal conductivity increases to 1.5 W/m K, thermal resistance is 5.0 / W. EcooL as a kind of organic resin type thermal conductive substrate with the substrate material, it in performance and metals (such as aluminum), ceramic base high thermal conductivity substrate materials, compared with the design of the higher degrees of freedom, convenient and flexible processing features, at the same time it in terms of voltage resistance, resistance to metal ion mobility can compete with other high thermal conductivity substrate material.
In addition, the cost price is related to the LED can end products to the market to accept the important factors, the price of LED lighting products still higher than energy-saving lamps, incandescent lamp. How to find a solution of heat conduction and cost trade-off between and the direction of the research and development of the industry. This day east new energy (suzhou) co., LTD. The city JiJunHang, said about the LED lighting, we think the enterprise generally for high power, high brightness products have very high enthusiasm, but such products for the general consumer prices too expensive, is not conducive to popularization, how to reduce cost is first thing to consider. Cost reduction not only focus on chips, a lot of supporting materials have a lot of price space can be mining. Nitto denko will focus on the LED heat dissipation, now to nitto electrical group based polymer technology, developed a high heat insulation materials, used in LED lighting field. On the price advantage more than ceramic substrates.
Different products have their own space
There are many different kinds of LED lighting products and various grade of products, so different thermal conductive substrate, both have their own space.
Despite the heat conducting substrate to high thermal conductivity, more active development direction, such as, different enterprises also developed the ceramic substrate, organic substrates such as various types of resin products, but also has its advantages and disadvantages between different products. LED lighting products, product variety, different class so different thermal conductive substrate, both have their own space.
, mau electron group general manager zhang kang pointed out in the school, PCB substrate process maturity, low manufacturing cost, can produce all sizes, but low coefficient of thermal conductivity (0.36 W/m K), easy to meet the thermal deformation of thermal expansion coefficient (12 ~ 15 PPM/K), process the limit temperature is about 288 , more suitable for low power LED. Metal substrate thermal conductivity coefficient in 2 ~ 5 w/m K, higher than the PCB but below ceramic substrates, process limit temperature about 300 , but below is also higher than PCB ceramic substrates, but their processing cost is far lower than the ceramic substrates, so it has wide applicability in the high power LED. Ceramic substrates has good thermal conductivity and high temperature resistance, suitable for high power LED, but the price is too high, and high strength material and brittle, can only produce small area of the substrate.
----------Archled Technology Co.,Limited