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Analysis on the advantages and development trend of integrated COB packaging

There are cost advantages, lower than the general LED packaging costs by about 30%". But industry experts said that the current integrated COB package itself and the cost ratio is not a light source of the device, there are obvious advantages, but the overall lighting application of low cost; performance of different COB light technology solutions in the performance and reliability of the device compared with the light source, each one has its own merits, most advantage is not obvious, but some solutions the product has shown obvious advantages (such as a 20% improvement in optical effect).

From the glass encapsulated into epoxy resin package to four piranha, SMD SMD chip integrated package, COB package, with high power LED lighting applications in the semiconductor deeply, the package form has changed several times.

From last year, the major forum for the situation, integrated COB package has become the focus of the industry's hot, the mainstream packaging forms of voice is high, and about its advantages and development trend of the topic has also been fully explored.

In fact, the advantages of integrated COB package integrated COB package has become fashionable for a time, and then was silent, but from the point of view in 2011, integrated COB package again favored, in this regard, industry experts said, COB packaging has become fashionable for a time, because at that time, more and more people from the simplicity and cost advantage and application of the structure but when, in the technical maturity, manufacturing process, material supply, product performance and reliability aspects temporarily can not exceed the threshold, then silence.

Since 2011, COB light source package technology has been greatly improved, the manufacturing process of industrialization tends to mature, material supply with better protection, light source products performance and reliability has been greatly improved, its importance is normal again. COB package can put one or two large chips, divided into a dozen small chips, you can do relatively small, relatively high level of heat dissipation efficiency.

Vertical angle, COB package in a limited volume can achieve relatively good efficiency, so it has a good performance in both horizontal and vertical heat dissipation.

Zhao Zizai, manager of the Light Industry Development Department of Limited by Share Ltd, said in an interview. In addition, integrated COB packaging in the heat dissipation, brightness and quality, color rendering and application are more advantages.

For example, the COB module package can form in the structure to reduce the combined layer and reduce the thermal resistance effect; multi chip support, help to improve the brightness; reasonable chip configuration, can enhance the optical effect; and in application, including packaging steps of material preparation, welding, assembly, the four main steps of molding. From the module to the assembly requires only 120 seconds.

The cost advantage is also integrated COB package is valued, insiders pointed out that compared with the traditional LED SMD chip package and high power package, COB package can be multi chip packaged in metal base printed circuit board MCPCB, through direct heat dissipation substrate, can reduce the cost of manufacturing process and support. The COB package is formed by directly bonding the chip to the heat sink. Only one package, can simplify two times with light, etc., has the cost advantage, lower than the general LED packaging costs by about 30%".

But industry experts said that the current integrated COB package itself and the cost ratio is not a light source of the device, there are obvious advantages, but the overall lighting application of low cost; performance of different COB light technology solutions in the performance and reliability of the device compared with the light source, each one has its own merits, most advantage is not obvious, but some solutions the product has shown obvious advantages (such as a 20% improvement in optical effect).

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