The success of the successful introduction of the second generation of photoelectric coating process

After years of research and development, the use of its own optical technology, the recent successful trial production of high-quality, high uniformity white LED.

At present in the market, the white LED package is generally yellow fluorescent powder mixed silica gel, covered in blue chips; because of uneven coating packaging technology, in two after the optical collocation appear yellow circle, macular and other issues, greatly reduce the quality of lighting.

In order to improve the light uniformity, packaging technology Edison photoelectric new import, using ceramic injection principle, close combination of unique multi axial fluorescent powder layer with Phosphor Layer EnvELope Technology: Multi-Axial (MAPLE), can be effective in peripheral chip light emitting region, forming a phosphor layer of uniform paste, the white light uniformity under the control of the 3-steps McAdam within the ellipse, the existing product color distribution within +-300K (below). Another collocation of different proportion adjustment, respectively, to meet energy star standards such as color temperature range; unlike traditional dispensing process, MAPLE technology can effectively reduce the labor cost and time, improve color uniformity, achieve the best, high quality white light.

Edison optoelectronics for MAPLE production technology, has applied for a number of packaging patent; this technology will soon be on the introduction of Edison photoelectric white series varieties of high power components, to provide a full range of high uniformity of the light source, to meet the market demand.