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New breakthrough LED heat dissipation To develop high-end market

Why the life of the LED lamps and lanterns has not been able to attain the life value theory? Because the bottleneck restricting the development of LED lamps and lanterns has not can be solved, is the failure, heat and light and heat as the main problem, recently, the author has LED the heat dissipation material and existing problems of lamps and lanterns has interviewed, general manager of shenzhen Confucianism for electronic JianYuCang Sir. 
Ceramic substrates why not sell good 
In when it comes to the important role of PCB, JianYuCang said, can say no PCB, electronics, circuit board as a carrier, is an important device of the LED lamps and lanterns, is a little lamp bead paste on the circuit board. Referring to a current more new types of ceramic substrates, JianYuCang said, good thermal conductivity of the ceramic, can achieve a few decades, so the industry as a new carrier, it relative to the copper base plate, aluminum plate, up more than a dozen times. Ceramic substrates has its own advantage, by good insulation and high relative to the metal substrate, the other in terms of conform to safety standards, performance is more superior. 
But why a ceramic substrate for so long, but has not been large-scale application? JianYuCang summarized several aspects of reasons, first, the price is expensive, it is the main factors that hinder its development, because in terms of the cost of LED lights, can only control in a certain range, if in the substrate to choose several times or even more than ten times higher than that of the conventional, so the cost of the enterprise will rise correspondingly. Second, the characteristics of ceramic, fragile. If the customer in the process of installation, carelessly, it is easy to cause damage to light; Third, the processing is difficult, difficult to shape. In addition it is important to note that the ceramic COB significantly worse than aluminum substrate in heat, even the best ceramic, coefficient of thermal conductivity is only 4 0 w/m (K *). And the coefficient of thermal conductivity of aluminum in 200 w/m (K *), the coefficient of thermal conductivity of copper is 400 w/m (K *). 
These comprehensive factors, led to the ceramics substrate is difficult to get a large number of applications, ceramic packaging use situation is relatively limited at present, mainly in some niche and concentration, cooling requirements higher light efficiency of lamps and lanterns, so difficult to achieve large-scale production. 
JianYuCang told me that the LED from the beginning of the birth, to flourish, or aluminum plate of the mainstream, because of the optimal ratio of aluminum substrate. In LED industry, people pay attention to most is cost-effective, aluminum plate is the main trend in the industry. 
LED industry problem - the heat dissipation 
JianYuCang said, LED from the date of birth, heat dissipation problems haven't get thoroughly solved, can be said to be a bottleneck restricting the development of industry. LED is in production, with the disease in the development, in the high speed development is hidden behind some concerns. As we often say a state of "subhealth". 
Why there will be light, because today's technology did not solve the problem of heat dissipation, which is why short of theoretical service life of the LED lamps and lanterns, to solve this problem, we must control the LED the node temperature not to exceed 85 degrees, more than the temperature, the chip itself can failure and phosphor oxidation. 
Industry has been the bottleneck, at the start of the light heat not immediately, all the lights bead is welded on the circuit board, so inevitable will generate heat resistance, leading to thermal conductivity is limited. The heat generated by the lamp bead would slowly come out, like a wall, to spread through the whole wall, the heat spread speed will slowly. More than node temperature can cause the light failure. 


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