Lower cost LTCC CSP package substrate available

Japanese friends of the Chinese company (YOKOWO) for LED packaging applications, developed with high heat dissipation and high reflectivity, the thickness of 0.075 ~ 0.150mm low temperature co fired ceramic (LTCC:Low Temperature Co-fired Ceramics) CSP substrate. The electrode material is silver (Ag) conductor. The inner part of the LTCC substrate is provided with a heat radiating plate, and a plurality of tiny CSP are arranged in the assembly, and the CSP and the right back through hole are at least one side of the front side or the back surface, and the bonding pad (Bond Pad) is processed.

In general, high brightness LED only 25% of the energy into light, the rest of the energy will become heat. The higher the temperature is, the lower the luminous efficiency of LED, so the user strongly demands to improve the heat dissipation of the package. Therefore, in the high current LED, considering the heat dissipation characteristics, the use of alumina substrate and aluminum nitride ceramic substrate packaging substrate more and more.

However, due to the low reflectivity and the precision of the substrate, the reliability of the LED chip is not reliable. In addition, there is a very high price of aluminum nitride substrate this problem. As a result, LTCC has developed a higher heat dissipation, support for miniaturization and thinness, and help to reduce the cost of the substrate.

The outer edge of the LTCC substrate is provided with an outer frame which is slightly larger than the CSP part in the form of an integral structure, so as to improve the processing capability of the packaging chip. In addition, the use of self-developed technology, greatly improved the bonding strength between the substrate and the LED chip. The dimension error is below 0.15%. Surface treatment was carried out by electroplating nickel gold (Ni-Au).

The development of the packaging substrate is currently LED packaging manufacturers to sample evaluation. Program in LTCC development and production base "cutting-edge device center" (Gunma Tomioka city) production. The center is the construction of the building area of about 500m2's new facility is scheduled to be completed at the end of May 2015, the friends of the Chinese in the new factory will arrange the workshop. According to reports, will build a monthly production of 500 thousand, the size of the 50mm square of the LTCC collection substrate production line, each substrate is arranged in thousands of sizes of 1 x 1 x 0.15mm CSP. Plans to start mass production after October 2015.

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