Canon mechanical enhanced LED packaging device business

Affected by the semiconductor market structure changes and economic depression, "SEMICON JAPAN 2009" (December 2nd ~ 4 day held) exhibitors is reduced by nearly 40%, but as one of the highly anticipated LED minority areas of growth for related devices and materials, the company is still active in the show. For example, the set of the largest exhibition di CISCO exhibited a variety of LED floor cutting device, etc.. Wafer handling device, not only 200mm and 300mm handling device, but also shows the suitable for LED 50mm and 75mm handling device. In addition, there are a lot of LED wafer display, attracting the attention of visitors.

Among them, the Canon Machinery (Canon) on the LED with Bonder (Die Bonder) and wire bonding machine (Wire). Solid crystal display on the company's new model, "BESTEM-D10Sp". Equipped with independently developed two arm linkage work "Twin Stamp" mechanism, while maintaining a simple mechanical (Mechanical) structure at the same time, to achieve a high speed of 0.18 seconds /Cycle (Bonding). Welding wire machine is exhibited recently in cooperation with United States kulicke & Soffa (KulickeSoffa) "ConnX LED" series.

In order to improve the production efficiency, the requirement for the equipment to enter the assembly line is higher and higher in the LED packaging device market. To this end, Canon machinery through the lineup in the product line to meet the requirements. In addition, Canon machinery and kulicke & Soffa first introduced to their respective clients to cooperate each other products such as business cooperation as the center, likely in the future "(Canon machine) to make both products such as the level of cooperation and linkage device.

"BESTEM-D10Sp"

"BESTEM-D10Sp" performance, etc.

"ConnX LED"