Anhui Province launches plan to accelerate chip “localization”

Recently, the General Office of the Anhui Provincial Government issued the "Opinions on Accelerating the Development of the Integrated Circuit Industry", which clarified the two-stage development goals of the integrated circuit industry in terms of industrial scale, key field applications, and industrial cluster construction: by 2017, the total industrial output value will exceed 30 billion yuan, and it will strive to double on this basis in 2020. The localization rate of chips in display panels, home appliances, automotive electronics and other fields will reach about 20%, forming an integrated circuit industry cluster centered on Hefei.

The integrated circuit industry is the core of the information technology industry. Starting from the ideas of adhering to market orientation and policy guidance, characteristic development and key breakthroughs, and key introduction and independent cultivation, the "Opinions" emphasize the four development principles of "reasonable positioning, focus on breakthroughs, characteristic development, and emphasis on application", and clarify four development priorities: giving priority to the development of the integrated circuit design industry, increasing the development of special integrated circuits in key areas, and cultivating a group of leading integrated circuit design enterprises. ; Break through the specialty integrated circuit manufacturing industry, use specialty wafer manufacturing as the entry point, and build large-scale production capabilities; improve the development level of the packaging and testing industry, improve the testing technology level and industrial scale, and strengthen coordinated and supporting development with the manufacturing industry; choose to develop related supporting industries, promote the development of integrated circuit special equipment in a focused and selective manner, and rely on Anhui Province's resources and technological advantages to accelerate the large-scale development of related supporting materials.

The "Opinions" proposed four major tasks, namely, promoting applications in key areas, organizing and implementing localized chip replacement projects, and promoting the formation of a linked development model of chip design, manufacturing, and application; building characteristic industrial parks to guide the clustered development of enterprises, and creating characteristic integrated circuit industrial parks such as home appliance frequency control chips, LCD main control chips, and automotive electronic chips; building an industrial innovation platform, building a public service system, promoting industry-university-research cooperation, and supporting the establishment of industrial alliances; expanding foreign investment, seizing opportunities for integrated circuit industry transfer, and strengthening the introduction of major core projects.