Yole D veloppement released the latest report LED package

Yole D vELoppement (Lyon, France) announced the latest annual report: 2011-2016 LED package in LED packaging equipment (including stripping (LLO), permanent bonding (permanant bonding), cutting (singulation) and test (testing) on stage investment reached $2 billion).

LED packaging has been the use of modified IC industrial packaging equipment and technology. Of course, we can enjoy the decades of accumulated IC industrial technology, but it also restricts the development of LED packaging industry. LED lighting market is expected to reach an annual output value of $20 billion in 2020, from the beginning of 2009, an unprecedented cycle of investment boom will continue until the first half of 2012. This wave was launched by South Korea, fully developed in china.

Yole D veloppement is expected to report the excess production capacity will lead to a period of 12-18 months the investment cycle continues to decline, will be reduced to 80% the previous value. Recession cycle will continue until 2013. And in 2013 will start another investment boom. Composite annual growth rate of 2011 to 2016 of the material and component suppliers will be stable at $27.6%. During this time, the packaging substrate manufacturers will get the highest CAGR of 45%; fluorescent materials will be a compound annual growth rate of 12%. In the fierce market competition environment, the companies have refined their respective business areas and applied for patent technology. Now the LED industry has entered a new platform, the production of large, widely used, the division of the fine manufacturers should be tailored for LED equipment.

New manufacturers also launched their own new products according to their different processes. The new LED packaging equipment will gradually replace the old IC industrial modification packaging equipment. Huge potential space for equipment innovation. In general, LED manufacturers to save the purchase and operating costs.

Yole D veloppement's report reviews the major challenges LED package process; and the prospect of a variety of technology are predicted, given two positive and negative reasons. The report also focuses on the recent market trends in high power LED packaging and arrays, and quantifies the specific values of a variety of materials and equipment associated with packaging and arrays. The analysis includes silicon substrate, wafer level packaging and COB.