Ten trends of LED packaging technology

Last month, Shenzhen kinglight optoelectronics Co. Ltd. "drive efficient light" to promote products successfully held in Guangzhou. At the meeting, crystal photoelectric display LED lighting, full-color display series, as well as the 3C series of three areas of LED packaging cutting-edge technology and the latest device products, attracting a large number of new and old customers to participate.

Kinglight optoelectronics was founded in 2008, the investment amounted to 200 million yuan, is a professional R & D, production of SMDLED, high power LED, application of LED product positioning in the high-end market of high-tech enterprises, focused on LED packaging technology and manufacturing field.

As of the end of 2012, the base of the crystal photoelectric production base area of 12000 square meters, nearly 800 employees, in 2012 the company's total output value exceeded $300 million. The company plans to achieve annual output value of 1 billion yuan by 2015. Crystal photoelectric market director Yuan Chang said at the promotion meeting.

According to Yuan Chang introduction, Jingtai optoelectronics introduced foreign advanced ASM automatic solid crystal machine, automatic welding machine, molding machine, automatic cutting machine, SMDLED automatic machine, SMDLED automatic loading machine, environmental testing machine and high precision optical microscope analysis system, computer analysis and other world-class automatic production line more than and 600 machine.

"The current monthly production capacity has exceeded 1000KK/ months, the company has made new breakthroughs in high efficiency, small size COB-MLCOB power type EMC light source and the ultra price COB lighting solutions research and development, business scale overall production in the domestic packaging industry. Yuan Chang said.

Packaging products complete unique design leading peer

In this promotion meeting, crystal photoelectric display with a new MLCOB (third generation COB packaging technology) as the representative of the full range of COB products, including high power LED, power LED and other devices used in lighting products. MLCOB as the third generation of packaging technology, the biggest advantage is that it can effectively improve the efficiency of light.

Crystal platform photoelectric Zhang Lei said that the current production of MLCOB product light efficiency is 160lm/w, the data in the laboratory is more than 200lm/w. At the same time, MLCOB takes into account the other advantages of COB. For example, good heat dissipation, MLCOB thermal resistance can reach 5 /W, easy to install, no thermal damage.

The difference between COB and traditional MLCOB with reflecting body of unique design, and adopts two times optical prism. The combination of these two technologies combined with the traditional COB technology, making the light effect of MLCOB products on the basis of the traditional 30%-40%. Zhang Lei said, MLCOB flagship high-end market, the main demand for future LED lighting applications will focus on the Gao Faguang rate, high reliability, high heat dissipation.

Zhang Maoneng, director of research and development at the crystal platform in the promotion of the meeting pointed out that the current impact of LED products into the interior lighting factors include price, reliability, standards and performance.

At the meeting, he also introduced the EMCLED (EpoxyMoldingCompoundLED) products, including 2835, 3014, 3020, four market mainstream specifications.

Among them, the power in the 2835 products with new packaging structure, with heat sink design; can realize high power 0.2W products, 0.5W packaging; high efficiency high brightness display, light efficiency can reach 120lm/w; small volume, LED product arrangement can be more intensive, more uniform light application effect etc..

LED packaging technology ten trends

In the promotion meeting, the general manager of the platform for the general manager of the company's future LED packaging technology trends and hot ten summary:

1, the power into the mainstream packaging. At present, most of the products on the market are high power LED products or small power LED products, although they have their own advantages, but also have an insurmountable defect. Combined with the advantages of the two power LED products emerge as the times require, becoming the mainstream packaging.

2, the application of new materials in packaging. Due to the high temperature resistance, UV resistance and low water absorption, such as better and better environmental tolerance, thermosetting materials EMC, thermoplastic PCT, modified PPA and ceramic plastic materials will be widely used.

3, chip current density applications. In the future, the current density of the chip will be increased from 350MA/mm2 to 700MA/mm2 or even higher. The chip demand voltage will be lower, more smooth VI curve (low calorific value), as well as ESD and VF.

4, the popularity of COB applications. With the advantages of low thermal resistance, light type, no welding and low cost, COM application will be widely used in the future.

5, higher light quality needs. Mainly for indoor lighting, crystal photoelectric will be LED RA indoor lighting products reached 80 as the standard, to RA reached 90 for the target, try to make the lighting product light color close to the Planck curve, so the light can be uniform, no glare.

6, international and domestic standards to further improve. I believe that with the continuous improvement of LED packaging technology, domestic and international standards for the quality of LED products will continue to improve.

7, integrated packaging light engine into a package of values. Integrated packaging light engine will become the focus of the next quarter R & D platform.

8, to power supply program (high voltage LED). The future will be more concerned about the quality of indoor lighting, but at the cost of driving factors, to power supply will gradually become acceptable products, and to fully meet the high voltage LED power supply scheme, but it needs to be resolved is the need to strengthen the reliability of chip.

9, suitable for scene lighting multi-color LED light source. Scene lighting will be the core competitiveness of LED lighting, and the next second LED lighting needs to rely on scene lighting to achieve.

10, the relative reduction in the efficiency of light efficiency, cost-effective to become the magic weapon packaging factory.