Packaging is the LED packaging enterprise revolution or extension?

With the LED industry ushered in the era of LED lighting, increasing competition, LED industry has the trend of M, high priced but less products occupy a head, the other side is considering the cost and large quantity of products, and the cost of the downward trend is increasingly clear.

As the middle part of the semiconductor lighting industry chain, LED packaging plays a vital role in the development of semiconductor lighting industry in our country, also have the advantage of scale and cost advantages in the global semiconductor lighting industry chain industry. In the face of strong competition, packaging enterprises, such enterprises in Taiwan and neighboring South Korea urges enterprises are facing tremendous pressure, many LED chip manufacturers actively developing non chip products, and the use of its high efficiency, light angle and other advantages, storm LED lighting market.

Packaging free "revolution" is a fallacy

Last week, the new century R & D center, said Dr. Chen Zhengyan, packaging technology is not only the integration of technology, rather than let the package disappear, basically packaging. Personally, as long as the process is to achieve a white light blue phosphor. As for why the packaging technology on the market, the reasons for the heat, Dr. Chen said that because of the package without eliminating some of the links, is to make the lowest cost of finished products technology. The only reason why we can only use the high power at present is the problem of high power technology in series, the series problems in the middle and lower reaches, and even the problems of the material system. Dr. Chen said that the package is free to have a chance to use small and medium power, but the current technology is more suitable for high-power packaging.

Shenzhen crystal photoelectric chairman Gong Wenhui said the free package is the trend, and he felt that the possibility of free packaging technology for large power for large power now indicated that the small and medium-sized technology cost advantage or go far away. He said that a technology can be long-term, but also related to the technology industry clusters, and now the world so much MOCVD can not disappear, the time required. And now the COB technology began to achieve intelligent LED high pressure, free packaging is also facing difficulties.

Packaging free heat is the trend of market development

Because LED lighting products price trend has never stopped, with the support of the mainland policy, let Taiwan LED chip factory R & D in addition to a higher efficiency goal, LED chip more cost advantage is also an important direction of LED crystal power plant, canyuan, Taiwan semiconductor solid-state lighting, TOSHIBA, PHILPS (Philips Lumileds), CREE are actively involved in chip development without package, omitting the package section, the overall cost of LED components will decrease again. Li Renzhi pointed out that with the bulb of the mainstream from 600 lumens to 800-1000 lumens, LED chip efficiency is not too big problem, the biggest problem is the cost.

Canyuan also uphold the philosophy of less is subtraction more "LED chip development, Li Renzhi pointed out that the canyuan PFC development package free products, the use of flipchip based chip design does not need to hit the line, PFC chip products free package has the advantage of light effect to 200lm/W, light angle greater than 300 degrees wide angle the whole week light design, and can not use the two optical lens, will reduce the cost of loss and the effect of light.

Li Renzhi said that the new product PFC canyuan will hit LED lighting market. Especially in the candle light, not only can simulate the shape of tungsten lamp, but also can break through the limit of the volume of heat dissipation, and replace the traditional 40W tungsten filament candle lamp, to achieve the 3.5W output light effect 350lm.