In 2022, Mini LED backlight has released new growth vitality in terms of technology, products and markets. Whether in large-size consumer electronics markets such as MNT and TV, or in small and medium-sized application markets such as VR, PAD, NB, and AUTO, Mini LED has become the focus of competition among players on the display track. Its direction in the two roads of high-end and high cost-effectiveness has become increasingly clear. Visual effects such as rich image quality, higher contrast, thinness, high brightness, and wide color gamut have set off a wave of consumer boom.
Cost is still the most critical factor that hinders the complete realization of large-scale commercial application of Mini LED. With the increasing application fields and market demand, further narrowing the distance between Mini LED display products and mass consumption, grasping the balance between cost and technology, and improving product yield while maintaining cost-effectiveness are core issues that the entire display industry chain needs to urgently break through.
"Materials + manufacturing" are added layer by layer to control costs
As an "IDM" manufacturer in the field of high-end semiconductor light sources, Huayinxin adheres to the vertical integration of design and manufacturing processes under the guidance of the "C²OX" technology path, controlling the entire chain from chip design - optical simulation - packaging process - driver design, opening up the upstream and downstream industrial chains, especially its advanced packaging processes and solutions, in Mini LED In terms of reducing costs and increasing efficiency, BLU plays a key role in connecting the past and the future.
Material cost is highly controllable Mini LED backlight packaging/module manufacturing is located in the middle of the backlight display industry chain and is the key to controlling product cost and performance. Huayinxin starts from the source of materials and links the three aspects of Mini LED light source, substrate and driver IC to develop technology, and fully promotes the miniaturization and integration development of light source chips. It has an independent Mini The LED chip production line is self-produced and used, and the cost is highly controllable. In terms of substrates and driver ICs, Huayinxin has in-depth cooperation with well-known domestic manufacturers. At the same time, Huayinxin’s self-developed Mini LED chips can be customized according to customer needs to meet the differentiated design needs of different products in terms of size, wavelength, voltage, etc. Manufacturing ensures high yield and high efficiency In addition to material costs, the manufacturing process is also the key to mini LED cost reduction. Huayinxin has a cutting-edge technology R&D team with rich experience in transfer technology and yield improvement. On the one hand, it uses the advantages of independent innovation to optimize the Mini LED backlight manufacturing process and combines it with a unique light source structure design to reduce the accumulation of deviations in the production process. On the other hand, Huayinxin has jointly developed high-precision die-bonding equipment with well-known equipment manufacturers. The die-bonding accuracy is as high as ±5um/±1° and the UPH is as high as 50K/H. It also has advanced fully automatic detection and rework equipment, which can effectively ensure the product pass-through rate. “2.1'' -- 65''” activates the application to improve the quality Currently, Mini LED backlight technology solutions include POB (Package-on-Board), COB (ChipOnBoard) and COG (ChipOnGlass). Among them, POB and COB are still the mainstream application solutions in the current market. Due to different application fields, technical solutions, packaging processes, etc., each has its own merits, so many manufacturers adopt a three-pronged approach to meet different customer needs. ↑ Detailed display of Huayinxin ACSP white light Mini LED backlight module To this end, Huayinxin strengthens R&D innovation and investment, continues to innovate, and based on the traditional Mini LED backlight technology self-developed ACSP white light backlight solution, which has the advantages of ultra-thin display body, automotive-grade reliability, integrated light control, million-level ultra-high contrast, etc. It can achieve higher contrast and uniformity at a smaller mixing distance, and the overall pass-through rate is as high as 98%. In terms of application fields, the company's independently developed ACSP white light Mini LED backlight series has laid out a multi-product matrix with different mixing distances from OD0 to OD7. The products fully cover mainstream application scene sizes in the market such as 2.1--65 inches and can be flexibly used in VR, PAD, NB, AUTO, MNT, TV and other fields. It can provide highly flexible and complete Mini LED backlight product application solutions for different customers. Currently, relevant products have been shipped in batches. "Innovation + Talent" two-wheel drive to welcome new growth Driven by the two wheels of "innovation + talent", Huayinxin will continue to leverage its advantages in vertical integration of technology from Mini LED chips, light source devices to terminal modules, focus on promoting the application in the field of automotive displays, and seize the new development growth points of Mini LED; at the same time, as Huayinxin's advanced Mini LED mass production line and chip line are put into use, it will work together with the upstream and downstream of the industry chain to further control costs and improve quality, accelerate the improvement of product mass production yields, and promote the commercial development of Mini LED displays.
ANNA