Recently, Xiamen Topstar Lighting Co., Ltd. announced that TSMC will use solid-state lighting, free package POD light source device, developed a new generation of lighting products.
After omitting the package, the overall cost of LED components will be reduced again. This is an interview with reporters frequently heard of the cost theory". These free packaging chips turned out, so that the middle part of the LED industry chain is a lot of packaging companies feel precarious". It is threatened by growing crises, fight to win or die? Was snatched from the jaws of death?
Opportunities and challenges
"Packaging is not not packaged. The industry said that although the packaging technology has been proposed for some time, but in addition to other domestic enterprises in Guangzhou, there are still no production, so the market share is almost zero. Insiders, LED lighting product process, divided into Level0 to Level5 manufacturing process, the manufacturing process for Level0 epitaxy and chip, Level1 LED chip package, Level2 is LED welding on PCB, Level3, LED module, Level4 is the lighting source, and Level5 is lighting system. LED factory packaging chip technology is omitted to the development of Level1.
Packaging is actually no gold wire package, but less than a gold wire packaging process. "Shanghai CDH Polytron Technologies Inc chairman Li Jiansheng said that all the chips are encapsulated into links, each device must be part of the package molding. Now appeared on the market is not packaged chip packaging devices, the two are essentially different.
Packaging link may disappear, the possibility of the chain into two sectors. "The general manager of Guangdong Zhonglong Communications Technology Co., Chen Bin put forward 3 reasons: one is the process and now improved chip technology for encapsulation less; two is the application of LED products in the past did not form a relatively uniform standard light source, after the LED package to the application vendor to processing to form the light source available, with standard the light source will gradually become a major trend, compressed package link space; three is the market competition makes the profit space more and more small, the upstream chip manufacturers will link directly to the package done, even to the end of the standard light source to do this.
Packaging technology changes, the traditional packaging enterprises will face a crisis of survival. "REFOND technical director Pei Xiaoming said that the current rise of chip scale packaging technology, once mature, will likely skip the upstream chip manufacturers to provide packaging manufacturers led to downstream application vendors, midstream traditional packaging manufacturers will be" short".
Ningbo Liaoyuan lighting Limited by Share Ltd Institute of Chen Haijun, director of the future, the future of the upstream epitaxial chip companies to do a good job of products, large-scale general-purpose products can be directly selected. But LED decides the characteristics of a variety of products, therefore, the application needs a chip factory can not meet all of the downstream enterprises, LED lighting will not only be used, therefore, for some special and custom applications to form, appearance, special type, the package will continue to exist, but is no longer necessary link.
Packaging is the inevitable trend of technological development. "Shanghai Institute of microelectronics Peking University professor Yan Zhongguang think, LED chip manufacturing technology is a major change, not packaged ELC chip two years ago in Taiwan EPISTAR R & D and production success, Guangzhou Crystal Electronics is also in production. LED chip factory R & D and production of high voltage LEDs this kind of wafer generated module has also been listed and in some cities to promote. But the small particles of LED chips still need to be packaged in order to apply.
Midstream packaging companies need to sit "revolution"
The development trend of LED packaging companies will bring a huge impact, but as the entire LED industry chain packaging will not disappear. Deputy general manager of Xiamen Hualian Electronics Co., Ltd. Ye Likang believes that the existing LED application is very extensive, and the future will continue to innovation, and different applications have their most suitable LED solutions, so all kinds of LED products will coexist, product's own existence space. In addition, when the chip level packaging products mature, flip chip eutectic without packaging line, LED products also need to solve the problem of heat dissipation, optical, weather resistance, reliability and a series of problems, packaging links can not be less.
In the eyes of Yan Chongguang, LED packaging factory to develop modular is the only way which must be passed, LED packaging factory can develop a LED light source module, the development of multi core package, development drive engine power chip and photoelectric LED light source with the aluminum substrate side of the stick "".
Packaging enterprises can not disappear, the progress of LED technology will give greater market space and innovative space packaging. The general manager of Ningbo Shengpu Optoelectronic Semiconductor Co., Zhang Riguang believes that now the LED market has penetrated into the general lighting, landscape lighting, special lighting, backlight, display equipment, household appliances, automobile including security, communication and even more new areas, which will give more space for the development of packaging enterprises. At present, LED lighting in the era of the replacement, may enter the era of creative products in the future, but no matter how the times, people will be more and more high quality requirements of light, and many technical problems can be solved only part of the package. With the development of new technology, packaging will only be used in a part of the lighting products, but to the packaging of the product is still able to maintain high quality, high performance is still unknown.
Recalling the packaging products a few years ago, has also undergone great changes, which is the technological progress to the packaging changes. In Zhang Riguang seems, LED package factory to master
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