Dow Corning model provides low cost thermal conductivity thermal grease

Dow Corning advanced technology and electronic business group launched DOW CORNING TC-5121 thermal grease, dedicated to the desktop computer graphics processor in order and electronic system. This is a new type of thermal grease has good thermal efficiency, the formula is also not easy to scratch the heat sink.

AMD has evaluated the TC-5121's low thermal resistance, reliability, and screen printability, and has recognized that this new material can be used for manufacturing. The thermal conductivity of TC-5121 is up to 2.5W/mK, and the thermal resistance is 0.1 cm2/W. These properties allow screen printing to achieve better results, the thickness (bondline) thickness becomes smaller and easier to apply materials.

Semiconductor manufacturers often thermal grease between the chip and the heat sink is coated with a thin, heat radiating fins will lead to microprocessors, graphics processors and other important parts produced. Currently other including LED, flat panel display and a variety of communications and automotive products and other markets, but also gradually generate demand for these thermal products. TC-5121 combines the Dow Corning silicone polymer with relatively small soft and heat conductive filler particles to reduce grease scratches on the heat sink. Dow Corning advanced technology and electronic business group launched DOW CORNING TC-5121 thermal grease, dedicated to the desktop computer graphics processor in order and electronic system. This is a new type of thermal grease has good thermal efficiency, the formula is also not easy to scratch the heat sink.

AMD has evaluated the TC-5121's low thermal resistance, reliability, and screen printability, and has recognized that this new material can be used for manufacturing. The thermal conductivity of TC-5121 is up to 2.5W/mK, and the thermal resistance is 0.1 cm2/W. These properties allow screen printing to achieve better results, the thickness (bondline) thickness becomes smaller and easier to apply materials.

Semiconductor manufacturers often thermal grease between the chip and the heat sink is coated with a thin, heat radiating fins will lead to microprocessors, graphics processors and other important parts produced. Currently other including LED, flat panel display and a variety of communications and automotive products and other markets, but also gradually generate demand for these thermal products. TC-5121 combines the Dow Corning silicone polymer with relatively small soft and heat conductive filler particles to reduce grease scratches on the heat sink.

Source: Electronic Engineering album