Dow Corning: innovative packaging materials boost LED efficiency

China LED network news] CSP technology applications will inevitably lead to innovative packaging materials market demand. "Said Dow Corning lighting solutions global marketing director Mr. Maruyama and by LEDinside in June 11th, Chinese LED net and the Guangzhou International Lighting Exhibition organized by the LEDforum LED 2015 Chinese international market trends forum.

Due to the particularity of LED packaging, packaging materials in the industry of high demand. The first is heat-resistant, eutectic reaction in the process of LED junction temperature above 150 degrees Celsius, require high temperature resistant packaging material; followed by high light stress, light output of LED is very high, the heat flux reached 100 W/cm2, requirements for packaging materials thermal bearing capacity is again good; stability in the packaging process, packaging materials and fluorescent powder chemical reaction or by oxidation, which requires its high stability.

Dow Corning started packaging materials of high stability, high refractive index from 2002 to 2006, the successful launch of the first generation of phenyl silicone OE-66xx series. Compared with methyl silicon, phenyl silicone has a higher refractive index, air tightness and stress relief, can help LED products to improve the light output of 7%.

Mr. Maruyama Kazunori said that after the advent of LED phenyl silicone, packaging material manufacturers hope that the mechanical reliability is better, so the second generation product of OE-7620/30/40, thermal cycling durability and its stress release has been greatly improved. In this year's Guangya Exhibition, Dow Corning brought third generation products OE-7651N/7662, compared to the previous two generations of products, this product has been a great breakthrough in the fluorescent powder compatibility and air tightness, effectively improve the color quality and reliability.

Talking about the latest technology trends of LED packaging, Mr. Maruyama Kazunori said, in order to reduce the overall cost and improve the performance of LED manufacturers began to dig into the chip scale package CSP, this trend will drive the innovative packaging materials market demand.

To this end, Dow Corning introduced a new packaging material, fluorescent film made of silicone curing hot melt package. When the temperature is below 60 DEG C, it is a solid, with viscoelastic; when the temperature is 100-140 DEG C, this material will melt, covered on the surface of the product; and when the temperature exceeds 150 degrees Celsius, it will heat curing, forming a fluorescent packaging film. This innovative material can simplify the production process and reduce the cost, and endow the LED package with higher design flexibility. At the same time, it can also improve the uniformity of phosphor distribution and provide better light quality. (text / China LED network Flora)

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