Disco laser cutting technology is applied to LED automatic processing for sales in China

Di CISCO high-tech in monolithic silicon wafer and low permittivity (low-k) laser film in the process of cultivating slotting cutting technology used in the LED experience, cutting equipment market for wafer laser in high brightness LED to obtain a higher share of. As the laser cutting equipment is automatic processing, so as to prevent the processing personnel because of the differences in the quality of processing caused by uneven. This feature is conducive to expanding sales in the Chinese market, and the company also has high hopes.

Sapphire substrate and SiC substrate toward the direction of the development of large diameter, thin increasingly high demand. As a result, the market calls for the introduction of a device capable of automatically and locally thinning a large diameter wafer. In order to meet this demand, di CISCO technology began to provide automatic grinding technology. According to reports, has been used in large diameter wafer LED manufacturers, some of which have been imported into the CISCO high-tech launch of the new spindle equipped with automatic grinding equipment, as well as grinding wheel and its application technology. CISCO technology is expected in the future Chinese market will continue to expand the use of large diameter wafers, intends to find business opportunities.