It is understood that the company plans to establish a joint venture with SMIC with 12-inch bumping processing and supporting testing capabilities. The joint venture contract was signed on February 20, 2014. After preliminary inspections, communication and all-round commercial considerations, the two parties signed the "Joint Venture Contract Amendment Agreement" on August 6, 2014. The registered address of the joint venture company is located in the Cayman Islands.
Through mutual cooperation, the two parties will introduce and jointly develop advanced and practical technologies, adopt scientific management methods, jointly develop a world-leading 12-inch bump business, and engage in silicon-level mid-range packaging business to promote and develop the advanced integrated circuit industry chain in mainland China.
The first phase of investment in this production line is in the form of leasing a Changdian Technology factory, which will be put into production between 2Q15 and 3Q15. The initial production capacity will be 10,000 pieces/month, and the production capacity will be 50,000 pieces/month by 2018.
A researcher at a securities firm said that advanced packaging is currently the best way to continue Moore's Law, and close cooperation between wafer factories and packaging factories is the core. Taiwan's wafer foundries such as TSMC and UMC have been supported by packaging plants such as ASE and Silicon Products in the past. However, the direct cooperation between SMIC and JCET is unprecedented in the world.
ANNA