Panasonic Electronic Materials (Singapore) Co., Ltd. exhibited the Ecool series of electronic materials this time, including Ecool-M high thermal conductivity materials for halogen-free multilayer substrates, Ecool-F high thermal conductivity flexible substrates, CEM-3 glass cloth-glass nonwoven substrate epoxy resin copper-clad laminates, CE6000 series LED reflective cup materials, R-8700 copper-clad phenolic paper laminates, etc.
EcooL-F high thermal conductivity flexible substrate has a thickness of only 0.025mm, a thermal resistance of only 0.6°C/W, a thermal conductivity of 0.3W/m.k, and a heat dissipation level equivalent to that of an aluminum substrate. By using extremely thin materials to achieve the same heat dissipation as metal substrates, EcooL-F can achieve thinner and lighter devices, making it suitable for the new generation of smart terminal products.
Ecool-M, a high thermal conductivity material for halogen-free multilayer substrates, has a high heat dissipation performance of 1.5W, can be made into multi-layer thin sheets, and can be used as plywood to achieve heat dissipation comparable to that of metal substrates, as well as easy processing and design properties that only resin substrates can have.
CE6000 series is a thermosetting molded plastic FULL BRIGHT, which is a material for LED reflective cups developed based on thermosetting resin. The CE6000 series has high reflectivity and maintains good discoloration resistance in high temperature and ultraviolet environments.
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