2015 into the integration of LED white package or the only growth force?

With the popularity of LED lighting, its total output value will exceed the traditional lighting. From the momentum of the development of the LED market, we can see that in 2015 will be a year of consolidation of the industry market.

From the overall trend, the 2014 annual domestic packaging market growth is not ideal, mainly due to increased competition in the industry, the decline in gross profit margin.

However, such as the display, backlight and other areas of growth is limited, the main growth in the lighting field, that is, concentrated in the field of white light. So in 2015, white packaging is almost the only growth force, and the competition will be further exacerbated, the decline in gross profit margins will lead to further market reshuffle, wash a large part of the uncompetitive enterprises.

As the main light source for lighting applications, white light packaging devices, under the environment of international energy saving and emission reduction, demand more and more, and the application field is more and more widely. From the European and American countries, Japan and South Korea and other developed countries, the gradual transition to the demand of developing countries and the domestic market. The current situation is that Europe, the United States, Japan and South Korea and other market demand has increased steadily, the outbreak of the outbreak of the developing countries and the domestic market, therefore, the lighting market should be in the fierce competition in the outbreak of a huge. Corresponds to the field of white light packaging will also be a huge opportunity.

In the context of increasing market competition, the price of terminal lighting products is an inevitable trend. The price decline, it will stimulate more market demand.

As a result of this market growth, prices and costs will be a major consideration for many customers. In the present situation of the same process, the details and local advantages have become the key to win more market. For example, higher brightness, better heat dissipation, longer life, etc..

At the same time, the new package results also point of growth, in recent years, many domestic and foreign research institutions and enterprises to continue to carry out research of LED packaging technology, packaging material with excellent and efficient packaging techniques have been proposed, the new LED lighting products have high reliability. For example, flip, three-dimensional packaging, COB packaging, etc..

Three dimensional packaging technology, for the LED packaging is a new concept, it is the design ideas and concepts, materials and packaging technology itself to make more innovative requirements. Three dimensional printing technology from today, there is considerable improvement, make the LED three-dimensional packaging technology becomes a possibility, but there are many problems need to be overcome, such as composite material preparation, thermal stress balance control and production efficiency etc.. Therefore, it can be said that the LED packaging technology based on 3D printing technology is still relatively distant vision.

COB (ChiponBoard) package structure is developed based on multi chip package technology, the COB package is the bare chip directly mounted on the circuit board, circuit board and bonding wire bonding through the key, and then the chip passivation protection. COB has the advantages of soft light, simple circuit design, high cost efficiency, saving the system space, but there is a problem of the integration of chip brightness, color temperature and system integration.

With the development of LED power, modular, low cost and high reliability, the requirements of packaging technology will become more and more severe, especially the packaging materials and packaging technology. Packaging technology is more complex, need comprehensive consideration, thermal, electrical, optical and other aspects of the structure, key and low thermal resistance, good stability and excellent novel packaging materials is still the packaging structure of LED packaging technology.

For more information about LED, please click on China LED network or pay attention to WeChat public account (cnledw2013).