The semiconductor lighting market is constantly growing. In the next few years, the penetration rate and application of LED in the lighting field will see a golden growth period. In addition, the application of LED in TV backlights, mobile phones, and tablet computers has also ushered in a period of explosive growth.
With the continuous development of LED, cost will be the main obstacle to the widespread application of LED in various fields such as general lighting, TV backlight, and mobile phone backlight. The continued decline in costs will become the main driving force to promote and occupy the market. In addition, vertical integration of upstream and downstream industrial technologies will inevitably occur, which will lead to many changes in product form and performance. The integration of upstream and downstream technologies in the industrial chain is one of the effective ways to reduce costs. As market demand increases rapidly and the pressure on prices decreases, the development of chip-scale packaging technology (Chip Scale Package, "CSP") has become a trend.
On November 6, at the "Chip, Device, Packaging and Module Technology (I)" technical branch of the 11th China International Semiconductor Lighting Exhibition and Forum (SSLCHINA2014), Wan Chuiming of Jinko Electronics (Guangzhou) Co., Ltd. gave a report on "The Development and Trend of Chip Scale Packaging Technology".
Currently, a large number of white-light LEDs are mainly realized by exciting yellow phosphors with blue-light LEDs. The technical route of blue-light LED chips in the industry includes three technical directions: formal structure, vertical structure and flip-chip structure. Flip-chip chips do not require gold wire interconnection and can be directly mounted on various substrate surfaces (PCB, ceramics, etc.), so they are particularly suitable for chip-level packaging (white light packaging is completed directly at the chip manufacturing stage) to form chip-level white LED devices.
Wan Chuiming said that the flip-chip technology route can perfectly realize the vertical integration of upstream and downstream technologies and is the mainstream technology route to achieve chip-level packaging. The LED chip market will be divided into three parts in the future, and flip chip will be one of them.
CSP refers to a package component whose package size is no more than 120% compared to the chip size and has complete functions. The advantage of CSP devices is that the packaging of a single device is simplified and miniaturized, and the material cost of each device is reduced as much as possible. "No matter what kind of packaging form, it will eventually move towards the technical route of chip-scale packaging CSP."
In addition, from the perspective of the application of chip-scale packaging products, it has the characteristics of small packaging volume, convenient design and integration of Lens; direct lamination, no substrate is required; larger light-emitting angle; high-density integration, good light color uniformity; large current drive, greater light output and other characteristics.
ANNA