Three in one module integration technology to lead the future development trend of LED lighting

As a new generation of green light source, LED has many advantages, such as environmental protection, energy saving, long life and so on. With the development of LED technology, how to reduce the cost of the system, how to overcome the technical problems, how to solve the matching between the components of the LED have become the factors restricting the development of the future LED lighting industry.

In the face of a series of problems in the development of LED lighting industry, modular integration technology is increasingly being put on. It broke the previous LED lamp manufacturing mode, the LED light source, a heat dissipation part and a power supply module integrated in a unified, lighting enterprises only need to buy the module can carry out lamp manufacture, solves the LED device module heat dissipation, light efficiency, cost and other issues. Industry experts believe that the future of LED in functional lighting applications will be modular, standardized and standardized production.

As a third LED dual core enterprise, Shenzhen express Photoelectric Technology Co. Ltd. has been committed to the development of LED module, to provide quality and efficient lighting solutions for customers, and in the development stage of each product to help customers solve four key technical difficulties of light, heat and electricity, machine and so on. R & D by the three R & D module integration technology has become the focus of attention in the LED industry.

Light source module to promote the standardization of the development of LED industry

Long Ke photoelectric light source module technology mainly includes COB and light source device +PCB two modes. COB chip On board package, is the bare chip with conductive or non-conductive adhesive adhesive on the interconnection substrate, and then realize the electrical connection of wire bonding (flip chip mode without wire bonding), LED chip and substrate integrated technology. COB packaging for long express will be divided into two categories: first, low thermal resistance packaging process; the two is a high reliability packaging process. Low thermal resistance COB packaging can be divided into aluminum substrate COB, copper substrate COB, ceramic substrate COB. Three kinds of materials COB packaging advantages are as follows:

At present, in some special occasions, lighting, reliability of the LED lighting requirements are particularly high, such as LED lights, LED tunnel lamp, LED lamp, LED lamp, LED light source based on the reliability requirements are very high. The ceramic substrate with high heat conduction and insulation performance, can solve the heat effect and electrostatic effect, other ceramic substrate and silica gel with good performance, which can solve the influence of moisture, in addition to the use of flip chip technology to remove gold further greatly improves the reliability of the light source component, therefore, the ceramic substrate COB the flip chip technology can meet the high requirements of the application field of LED.

The second type of technology for the PCB+ light source devices and power supply integration of the formation of the light source module, the main advantage is to promote the standardization of the light source module to facilitate the production process of LED lighting manufacturers.

(long express 15W IC drive bulb photoelectric module) (long express 22W IC drive dome photoelectric module)

Above only 2835 examples, there are 3535 and 3528 lumens, imitation ceramic and PCB+ light source device and a power driven mode, can be applied to the LED lamp, LED lamp, LED fluorescent lamp, LED bulb, LED downlight and other fields, greatly facilitate the LED lamp manufacturers.

Interface standardization is imperative

In recent years, LED industry ushered in the great development opportunities, but due to the lack of industry standards, is extremely easy to cause the strategic emerging industry market competition disorder, the waste of social resources, the market prospect is ahead of overdraft situation. As the drafting unit of Guangdong standard optical component project level two standard, long express optoelectronics has been committed to the standardization of LED products.

Standard interface for light source components include: COB standard interface and light source device +PCB standard interface two categories.

(1) COB standard interface

In this case to illustrate the ceramic COB. At present in the actual use of COB ceramic products, the ceramic substrate has good thermal conductivity, is difficult in the actual welding process; on the other hand, because of the characteristics, so the ceramic has a fragile, for the development of a set of COB ceramic press and lamp holder lead out led by election.

Through the lamp holder, on the one hand to play the role of fixed ceramic COB, on the other hand play the role of electrical connections.

(2) +PCB standard interface for light source devices

In the PCB board with connectors, not only eliminates the manual welding time, so that the installation is more efficient, in addition to the maintenance is also more simple.

Efficient heat dissipation to solve LED lighting bottleneck"

In general, LED lighting products are stable, the quality is good or bad and the body itself is the most important heat dissipation mechanism. LED lighting is mainly composed of LED, heat dissipation structure, drive, lens, so the heat is also an important part, if the LED can not be very good heat dissipation, its life is bound to be affected. At present, the power of LED is about 70%-80% into a hot form, so how to minimize the temperature of the LED component, has always been the focus of the application side of the problem.

According to the express related R & D personnel, for LED, select the appropriate operating environment, and quickly remove heat generated after the LED LED light can maintain the life and performance of the original, the heat conduction way mainly by heating body (LED components) to the radiator, the radiator heat conduction and convection through the heat dissipated into the air and through the surface heat radiation heat removal fourth method.

For different heat dissipation methods, long express Optoelectronics in the radiator set