The interpretation of LED packaging trend: technology development is the right path

LED energy-saving lamps from landscape lighting to functional lighting, and ultimately into the home from the outside is the trend. 'Shijiazhuang Warwick bar technology development Co., Ltd. General Manager Zhang Yusen said, LED lamp life is long, fast response characteristics, is also very suitable for the development of intelligent applications. For example, with the LED corridor lamp, night lamp, infrared control stair lamp, don't have to clap, stamp, cough, very convenient.

Recently, by visiting the Shili River in Beijing, Ruifeng international and many other lamps, lamps and candles of a myriad families market, LED lighting products Home Furnishing poured into the lighting market. ''LED lamp prices higher, affecting the consumer's desire to buy. "Beijing city lighting lamps and candles of a myriad families a dealer said, for example, in the Beijing market, 3 Watt LED lamp is priced at 20 yuan, 7 WATT soared to 90 yuan; and energy-saving fluorescent lamp is usually about 10 yuan can buy incandescent lamp, only 1 yuan of money.

Currently, LED lighting is not suitable for the master lighting. 'used LED ceiling lamps of Beijing citizens Mr. Liu said, LED light does saving environmental protection, but not too bright, too dazzling, and for the general energy-saving lamp.

At present, there are still some problems in the domestic LED lighting. One is the heat problem, the current domestic technology for aluminum radiator, the radiator and the LED chip if too tight, it will affect the life of LED light; two is changed of brightness, which requires a controller to adjust. If the domestic enterprises are concerned about 'staking' ', do not focus on technology research and development and to meet market demand, LED energy-saving lamps will be difficult to really enter the home market.

LED packaging principle

The LED package is to provide a platform for LED chip, LED chip has better optical, electrical and thermal performance, good packaging can make LED have better luminescence efficiency and good heat radiating environment, good environment and enhance the service life of LED. LED packaging technology is mainly constructed on five main factors, namely the optical removal efficiency, thermal resistance, power dissipation, reliability and cost performance (Lm/$).

Each of these factors is very important in the packaging, for example, the efficiency of light extraction is related to the price performance ratio; the thermal resistance is related to the reliability and product life. Overall, the better packaging technology is necessary to pay attention to every point, but the most important thing is to stand in the customer's position to think, to meet and exceed customer needs, is a good package.

According to the composition of package materials of LED, and with Lin explained, LED package is mainly composed of a substrate, a chip, solid crystal glue, phosphor, encapsulation and other components, we first use the solid crystal glue chip attached to the substrate, the use of gold will be electrically connected with the chip and the substrate, and the fluorescent powder and packaging glue mixed collocation different fluorescent powder proportion, and the chip can get the appropriate wavelengths of different colors, the mixture of fluorescent powder and plastic packaging is poured into the substrate, heating baking glue after curing, to complete the most basic LED package.

Four development trends of LED packaging

LED packaging technology is mainly to high luminous efficiency, high reliability, high heat dissipation ability and thin development. From the chip, the most common is the level of the chip, more high-end manufacturers developed vertical flip chip and chip, the original level of type LED sapphire substrate, the heat capacity is poor, and driving at high current, light extraction efficiency decreased greatly. Therefore, in order to reduce the cost of LED, chip design with high current density to obtain more light output as the main research direction, in this respect, the use of vertical package will become the next topic, this chip using silicon high heat dissipation substrate, has better cooling efficiency in high current operation, so it is there is a higher light output, but the production process is complex, the process yield rate is too low, resulting in high cost, unable to reach the ideal in the high wattage package, process yield due to the price factor is a major consideration.

Taiwan Electronics Co., Ltd. is a collection of science and technology specializing in wafer level high power LED silicon based packaging technology industry. The company has entered the Chinese market in 2010, street lamps, in 2011 will be more focused on indoor lighting bulb products. Caijue science and technology LED technology research and development director Li Yuhua said, with the 8 inch epitaxial calculation, the caijue package capacity of single month 2 thousand, equivalent to 4 million last year, products enter into China lamp products, large amount of time or even monthly shipments of up to 70-80 million.

LED packaging technology is mainly to high luminous efficiency, high reliability, high heat capacity and thickness of four directions, the main highlights of the silicon LED and high voltage LED, silicon LED has attracted more and more attention, because it is better than the traditional LED sapphire substrate cooling capacity, so the power to do more, Cree will focus on the development of silicon based LED, its main problem is that the yield is low, cost is also high.

High pressure LED is another highlight, because it can be greatly reduced input and output DC-DC circuit of differential pressure, and further enhance the efficiency of LED driving power, which can effectively reduce the requirements of LED lamp radiating casing, thereby reducing the overall cost of the LED lamp. At present, Cree, Osram and 100 million in the development of high-pressure LED process. Billion Optoelectronics (Everlight) research and development, said Lin Zhimin, director of the two: the future billion light will expand R & D and application of high voltage LED products, the integration of more components to create a simple application