Study on the multi wavelength nano resin materials for the packaging of optoelectronic devices developed by Shenzhen Institute of Optics and electronics. This series of materials can be in accordance with the ultraviolet, visible light and near infrared transmittance of different bands and different, different cut-off rate, directly applied on the photosensitive device, sensor, LED and other products, instead of expensive optical lenses, especially for optoelectronic components factory production, improve product quality, reduce the cost. This product is still the first in the country, there is no similar foreign products reported.
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