SEMI forecast: 2011 global LED wafer processing capacity will increase by 50%

International semiconductor equipment and Materials Association (SEMI) released the latest "Opto/led Fab Forecast". Announced the future of the global LED production line, the number of new manufacturing equipment investment and wafer processing capacity forecast.

SEMI released data show that in 2010 there are 19 LED production line started construction. SEMI predicts that in 2011 there will be 27 production lines completed. In addition, SEMI is expected in 2012 there will be 15 new production line plan. Leading global LED production line is the new trend of china. According to SEMI introduction, the Chinese local government on the new LED production line positive performance, China's new production line in the world has accounted for about 50% of the number of new build.

Secondly, the investment in LED semiconductor manufacturing equipment has increased from $606 million in 2009 to $1 billion 780 million in 2010. SEMI forecast 2011 equipment investment increased by 40% over the previous year, reaching $2 billion 500 million, about $2 billion 300 million in 2012. However, SEMI points out that some of the investment plans for 2011 could be delayed until 2012.

On wafer processing capabilities, SEMI said the global LED wafer processing capacity has reached 4 million 350 thousand / month (50mm wafer conversion, the same below). The analysis of strong demand that LCD backlight promoted the wafer processing ability. SEMI predicts that in 2011 the wafer processing capacity will be increased by 50% over the previous year, reaching $6 million 509 thousand / month.