After more than 20 years of packaging technology research and development, he has gradually transformed from an engineer of underlying technology and overall solutions into a Feng Shui expert in the packaging industry. Pei Xiaoming believes that “CSP is definitely a new trend in packaging in the future, but its penetration rate and market share are not as large as imagined. By Since CSP is a package without a bracket and a substrate, from the perspective of phosphor coating, the technical route taken by CSP may be the coating of liquid phosphor, fluorescent glue, or the coating of solid fluorescent film. In this regard, the investment in related equipment may change. ”
At the same time, Pei Xiaoming pointed out that after the emergence of CSP, it seems to be possible for chips to jump directly to lamps. And whether the packaging is damaged due to a short circuit, whether the chip factory and the packaging factory have changed from original partners to enemies, and how should the chip factory and packaging cooperate. Pei Xiaoming emphasized, "This market cannot be monopolized by one company. CSP is not a unique advantage of chip factories. Packaging factories do not necessarily do worse than chip factories in doing CSP. Packaging factories have vast customer resources, and chip factories can provide CSP to packaging factories. After the packaging factories make modules, they are handed over to downstream application customers."
What is particularly noteworthy is that as LED lighting gradually moves towards standardization, the module form derived from the packaging and application end will also become an industrial form.
What is particularly noteworthy is that as LED lighting gradually moves towards standardization, the module form derived from the packaging and application end will also become an industrial form.
The U.S. Department of Energy DOE report estimated that from 2012 to 2020, the cost of the entire LED packaging product will drop 6 times. In this regard, Pei Xiaoming believes that if it is achieved purely from materials or improving efficiency, without revolutionary technological evolution, it will be difficult to achieve this goal.
LED packaging has evolved from direct plug-in LEDs, to high-power LEDs, PLCC LEDs, to ceramic packaging, EMC packaging, and the most popular chip-scale packaging CSP. The entire technology evolution has always revolved around the theme of cost-effectiveness (lm/$). Pei Xiaoming said that the progress of LED technology is largely due to the progress of related basic materials. From PPA materials, PCT materials to ceramic materials, as well as the most popular EMC and SMC material technologies in the past two years, the refractive index of materials continues to increase, and their heat resistance and UV resistance continue to improve, which has a considerable impact on improving the performance of the entire product.
The technologies that affect LED packaging are first of all solid soldering technology, from the earliest silver glue solid crystal, insulating glue solid crystal to eutectic; secondly, in terms of bonding wires, from the earliest gold wire bonding wires to flip-chip gold-free wire bonding wires; thirdly, in terms of phosphor coating technology, from the earliest dispensing process, graphic coating process, to remote excitation process. In Pei Xiaoming's view, the evolution of these technologies will have an impact on packaging manufacturing processes and equipment investment.
When the demographic dividend is no longer an advantage, the biggest change in the packaging production line may be the replacement of labor by machines. In addition, product standardization, production efficiency, and capital scale will become the mainstream of the packaging industry.
Finally, Pei Xiaoming concluded that the traction of market demand and the promotion of technological progress are the two major driving forces for industrial development. Technological evolution always revolves around product cost-effectiveness, and cost is the first factor. The introduction of new technologies will have a certain impact on the traditional packaging industry. LED packaging will ultimately be a low-profit industry that competes for capital, scale, and management.
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