Rom lock three product lines

"After integration, Rom will lock the three major product lines: one is the LED, from the LED driver, LED backlight to LED lighting products, industrial chain across the board through the. Two is the next generation of power devices, the main application of new materials SiC SBD (Schottky diode) and SiCMOSFET (Semiconductor FET). Three is the sensor, the development and application of a wide range of MEMS acceleration sensors. "General manager Rom Li Jun Chinese semiconductor design center in the fair of" Chinese electronic newspaper "reporter stressed the strategic layout of Rom. After more than 50 years of development, Rom, is the new outbreak and the accumulation of power.

Three product line advantage accumulation

Roma "advantage in the LED field is high brightness, small size, and provides a set of solutions. Li Jun pointed out. Rom has launched the world's smallest and thinnest patch LEDPICOLED-mini series, showing the leading edge in the field of Rom. Reporters saw the car at the show for the front of the car, the tail of the development of LED driver solutions. According to the exhibition staff, the front end of the car LED driver program efficiency, strong anti-interference, good heat, there is already a customer ordering Roma products.

Hybrid vehicles, electric vehicles, such as wind power market warming led to the power devices demand. To improve the device driven by electrical energy into mechanical energy conversion efficiency is very important, it needs to reduce the occurrence of loss in gear and the transmission shaft part, and the power device installed in the motor can reduce the loss of internal. "The traditional Si module can not be installed inside the motor, because it can not withstand the high temperature environment of 200 degrees celsius. In addition, it also requires a lot of cooling equipment, low efficiency, large loss. Li Jun said, while the SiC module can not only work at this high temperature, and it can be more compact, the volume is reduced by 50%. At the same time, it can radiate from the back and the surface, so the efficiency is higher. Rom last year, the acquisition of the SiC wafer supplier SiCrystal company in Germany, and the early and late processes are concentrated in the completion of the branch of the Rom, thus establishing a SiC device one-stop production system. Li Jun introduction: the current production of its Schottky diode, next year, SiCMOSFET will enter the market. "

Last year Rom merged with the outstanding performance of the American Kionix company in the field of acceleration sensor, to further consolidate the Rom in the field of sensor strength. Rom demonstrated the use of mobile phones and digital cameras and other devices, the corresponding non-contact motion detection of single chip light and proximity sensor IC. The exhibition staff, applications in the field of sensor is the largest mobile phone, the main need light sensor, proximity sensor, acceleration sensor, the light sensor and proximity sensor to achieve the ram combo, realizes the non-contact detection function of the industry's first action. Roma will also be based on market demand in the future on the basis of the acceleration sensor integration with the "three in one" chip.

Strengthen China layout

Chinese Roma market has been one of the most important market, now has been formed with 4 sales companies and 15 Liaison Office for the structure of the sales network in Shanghai, Shenzhen and Hongkong established a development center in Dalian, Tianjin established a production base, namely the one-stop system built in development sales and manufacturing in one of the Chinese in. Li Jun introduction, in order to quickly respond to the requirements of the expanding Chinese market, Roma plans to continue to expand the sales network in China, the future focus is to further promote the localization.

Li Jun said that the Roma China localization strategy:

Is a former from wafer manufacturing to product development is mainly done in Japan, and is currently in the Shanghai development center began development of the whole industry chain.

Two is to develop product development roadmap for Chinese local market demand, such as through cooperation with the Tsinghua University, dedicated to the development of DTMB Chinese terrestrial digital TV receiver chip, has launched the demodulation chip, the utility model has the advantages of built-in AD converter and SDRAM, good noise immunity.

Is three for local application, provide the corresponding solutions. For example Chinese networking market demand concentrated in the sensor, memory and communication module etc., Rom will focus on a main push sensor, two is the development of EEPROM, the three is the development of communication standard modules such as ZigBee module etc..

Is worth mentioning, Rom signed a joint production agreements with Tsinghua University in 2006, and actively carry out on the electronic components of the most cutting-edge technology of production, joint development. In the Tsinghua University by Rom investment of about 2 billion yen to build the Tsinghua Electronic Engineering hall is expected to be completed in April 2011 by the end of.

China according to market demand, Rom's wide product line so that it can develop their skills in various fields, including power devices, MCU, sensor, universal memory, audio and video processing IC, SiC module, wireless communication module, display technology and so on. Li Jun mentioned, in addition to providing wireless communications Bluetooth, ZigBee RF technology, the future will develop Wi-Fi RF products.

Sales and development team ram has Chinese elements, not only emphasizes the quick response to customer demand, is also very focused on customer service such as technical services, through continuous improvement of the design system, to provide the corresponding products and solutions. Li Jun stressed that.