Replace 60 watt incandescent bulb LED chip manufacturer with 800 lumens in place

All standard incandescent disabled and FMCT will be launched since 2011, Toshiba (Toshiba), PHILPS (Philips) and light emitting diode (LED) lighting manufacturers exhibition kick-off lamp deployment, especially in the high voltage (HV) LED Diego technology progress, LED chip factory has successfully developed 800 lumens ball bubble lights, and is actively developing more than 1000 lumens bulb, in order to speed up the attack after a 60 watt incandescent bulb layout.

Replace 60 watt incandescent bulb LED chip manufacturer with 800 lumens in place

With the development of disabled and cut-off incandescent lamp time gradually approaching, Toshiba, PHILPS, GE, LEDON OLED Lighting, LED lighting manufacturers had to strengthen the layout wildly beating gongs and drums's product line, in addition to "long life, luminous efficiency and price advantage, EPISTAR R & D Center Research Associate Xiangjun said Hong nitride group, whereas the the cost is the key to the popularity of LED lighting, 800 lumens bulb, up to 1000 lumens per dollar package, high voltage LED and increase LED warm white light LED will represent the general trend, thus become the LED chip business to cultivate the technical key.

Recently, PHILPS, Toshiba took the lead in the industry to develop 800 lumens of LED bulb, to replace a 60 watt incandescent bulb, the goal is to reach the price of $40 in 2011, to replace a 40 watt incandescent bulb $20, to reach $8 in 2015. Hong Xiangjun analysis, in order to reduce the optical loss, the future is bound to LED lighting manufacturers beyond 1000 lumens forward.

In addition, Hong Xiangjun stressed that the cold white and warm white LED observation of luminous efficiency, price evolution, in order to speed up the LED to replace the incandescent lights in the city accounted for $1000 each, packaging technology will be irresistible lumens, once the smooth production, cold white LED will reach 1 lumens per thousand dollars, for each LED chip factory in 2015 target. Expected to 2012, 500 U.S. dollars per lumen LED smooth mass production, will help expand the LED lighting market penetration of up to 30%.

Another concern is the high voltage of LED, compared with the current scheme, high voltage scheme can decrease of luminous efficiency is reduced, and the implementation of more efficient drive, AC scheme does not appear fault defects plus, and low manufacturing cost and easy production, will become the most easy to achieve high performance LED lighting solutions. Xiangjun Hong pointed out that the high voltage LED mainly aimed at indoor lighting, will facilitate the design of simplified LED and power converter.

At present, many LED chip makers are trying to increase the red LED by AIGalnP in the realization of high CRI, Hong Xiangjun, compared with blue LED mixed fluorescent powder warm white color scheme was 82%, mixed warm white light LED color rendering can be as high as 90%, so the market will be the main stream. Today, the red LED luminous efficiency has reached 180 lumens per watt, blue LED has reached 162 lumens per watt.

On the other hand, compared with the traditional LED packaging technology, flip chip (Flip Chip) (also known as inverted crystal) package technology has high yield rate, thermal effect, strong light and thin characteristics increased, thus gradually in LED packaging fields, but the initial investment, output per hour (UPH) than the traditional process is low, will overcome the LED packaging manufacturers to development challenges.

Flip chip packaging exposed investment cost /UPH test multiplier

Everlight three R & D department deputy director Xu Xichuan said, flip chip technology has good heat dissipation, light area increases, miniaturization and high yield advantage, thus gradually gain market favor, but because of the initial investment amount is considerable, and less than the traditional UPH (Die+Wire Bond) to the crystal process, so that the cushion of high technology enter the threshold, but also become a technical problem in LED packaging business actively overcome.

Although the traditional binding process has a low initial investment amount, high production capacity and can be used in the production of both the advantages of equipment, but there is not easy to heat, small packaging yield is difficult to upgrade, high temperature bonding and other defects. Different from the traditional LED packaging solid crystal mode, the flip chip packaging system will flip the chip directly on the substrate of the gold bump (Bump), and then by external energy to achieve the purpose of solid crystal. This technique helps to shorten the LED process in high temperature baking time, material to reduce the thermal stress, and simplified process is easy to yield control, in addition, due to the heat generated by the chip through the gold bump conduction to the substrate, the thermal effect is good, and the removal of the chip electrode shielding a smooth product, resulting in a light increase. The packaging process requires the quality of materials, namely, the substrate coating, chip electrodes, as well as the design of ceramic nozzle, wire material / wire and process parameters.

The energy-saving lamp luminous efficiency, energy saving, environmental protection and life, volume is less than LED, plus the British Ministry of Health issued a warning of energy-saving lamps, energy-saving lamps will lead to serious danger of breaking the release of mercury, and cause environmental pollution, so although the LED price competitiveness is not the enemy of energy-saving lamps, after the potential is still great potential. In order to accelerate the popularity of LED, coated packaging technology will be expected to come to the fore in the market, to attract LED packaging plants competing layout.

Another concern is that in the LED configuration design evolution intensive, high thermal conductivity and heat dissipation substrate demand incentive, add to the LED substrate, miniaturization, and outdoor lighting and large-scale products for reliability requirements more stringent, because the aluminum substrate miniaturization difficulty, expansion coefficient is high, then the ceramic substrate and silicon taking advantage of the rise of substrate, especially silicon substrate capacity from 4 inch to 8 inch wafer upgrade, will help accelerate the commercialization of a target.

Miniaturization / high thermal conductivity demand Yin LED silicon substrate emerge

Juding science and technology Deputy Risa Yian said high thermal packaging technology can reduce the interface