Non packaged LED chip undercurrent surging European and American Taiwan battle

After the LED lighting industry into the era of price pressure has never stopped, constantly looking for new opportunities, at present both Europe and the United States, the mainland or Taiwan LED factory to invest development of chip package, no chip packaging technology is undoubtedly a major focus of the industry in 2013.

The LED lighting product process, divided into Level0 to Level5 manufacturing process, the manufacturing process for Level0 epitaxy and chip, Level1 LED chip package, Level2 is LED welding on PCB, Level3, LED module, Level4 is the lighting source, and Level5 is a lighting system. LED factory packaging chip technology in order to avoid the development of Level1.

CREE and PhilipsLumileds are also actively declared in CSP product development results, PhilipsLumileds launched LUXEONQ using flipchip technology, does not need to be removed in the BEOL sapphire substrate, locking directly replace the market popularization and application of mature 3535 package product specifications.

While CREE's XQ-ELED products also adopt CSP technology, the chip area is reduced, and the XP-E2 has the same performance level of illumination, and the size is reduced by 78%, only 1.6mm*1.6mm, the miniaturization design can enhance the light color quality and optical control, expand the application range of lighting.

Taiwan LED chip factory in the chip package without product development pace also actively, EPISTAR ELC new products used in semiconductor manufacturing, will save the package (Level1), including lead frame, wire in the past do not need, leaving only the chip collocation fluorescent powder and plastic packaging use, and can directly patch (SMT it is reported that the use of), the supply chain has to enter the crystal electric backlight ELC products, the future will also be used for lighting market.

Canyuan also developed the PFC package free products, the use of flipchip based chip design does not need to hit the line, PFC free chip package product has the advantage of light effect to 200lm/W, light angle greater than 300 degrees around the ultra wide angle optical design, and can not use the two optical lens, will reduce the consumption and cost of light the effect of the.

While the Taiwan semiconductor solid-state lighting products without package called PoD (Phosphorondie), flipchip (direct flip chip) on a radiation base, omit the lead frame and wire and other steps, also hit the small volume has a higher luminous flux, luminous has a larger angle, and can more easily mix color with the regulation of temperature characteristics for non directional light application.

LED continuous low price trend also allows manufacturers to continue to consider ways to reduce the cost of production, the cost of the package should not be considered naturally.

Including Taiwan LED chip crystal power plant, canyuan, one-stop factory Taiwan semiconductor solid-state lighting, Lunda, Toshiba, CREE, PhilipsLumileds international companies are actively involved in research and development and production of non packaging products.

With the LED chip packaging products factory and one-stop factory now launched, crystal electric no packaging products, the main push ELC (EmbeddedLEDChip) in the process of chip production, only need to be coated with the fluorescent powder and sealed with glue, omit the lead frame and the wire step can be directly (patch the use of ELC products, SMT) in the absence of the lead frame, the light emitting angle is larger, the use of the future will have the opportunity to omit the two optical lens.

However, the majority of non packaged products are still stuck in the only smell the stairs, do not go down the stage, the production rate of non packaged products affect the speed of production of this product.