New trends in LED packaging: cost, performance and reliability

China LED Reuters] the future of LED lighting is mainly derived from the replacement of the main home lighting and commercial lighting, to the direction of universal lighting, LED packaging products put forward higher requirements. The most important is the cost control, no cost control, there is no way to make the lighting industry bigger. "In LEDinside, China LED hosted LEDforum 2015 China international LED market trends Forum, OSRAM Opto Semiconductor solid-state lighting senior marketing manager Wu Sen speech phrase.

OSRAM Opto Semiconductors solid state lighting senior marketing manager Wu Sen

In addition to the cost requirements, the terminal market requirements for LED as well as performance and reliability. What should be done as a packaging plant in order to achieve a balance between cost, performance and reliability?

According to the U.S. Department of energy (DOE) forecast, before and after 2020, white LED light efficiency can reach 230lm/W. To do this, we need a lot of efforts, not just quantum efficiency, but also the efficiency of LED. Today's LED packaging, more focused on the chip structure, packaging materials and other aspects to improve light efficiency.

Wu Sen said, on the market of LED packaging materials and packaging forms generally have a trend, small and medium power products will use PPA or PCT package; in high power level products, has been widely used in the EMC package, this is also the two popular technologies; and the traditional ceramic package of high power LED, and rapid development in recent years, the COB package, which constitutes the mainstream LED package is basically on the lighting market.

Different packaging methods have their own advantages and disadvantages, the interesting phenomenon is that in recent years, EMC packaging in the indoor lighting has been greatly developed, especially in the middle of the 3030 represented by high-power products. This raises the possibility that the EMC package will not be able to move towards greater power

In this regard, Wu Sen put forward the idea of high-power products to the EMC integrated chip packaging, from 500 - 1500lm level, the integrated chip EMC products to replace the low power COB, or replace the multiple applications of the 3030 level. The future does not rule out the possibility of more than EMC 20W integrated chip package.

The small and medium power products as a result of increasing market share, there is no LED technology can take into account the cost, performance and reliability?

OSRAM's approach is to develop a PureLED, you can achieve the most balanced from the cost, performance and reliability. First of all, it is not by the use of flip chip, but has mass production in the 5630 or 3030 package on the chip, so in the beginning you can put down the cost of the chip control; secondly, because it has a base, in the welding process and the risk is relatively low; thirdly, the chip technology is relatively mature, use of large quantities of the reliability assurance. Therefore, the PureLED achieved a balance of cost, performance and reliability, with the market on the 3030, 5630 and CSP, such as low power products leading. (text / China LED network Amber)

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