Listed companies Tianlong photoelectric joint R & D R & D MOCVD

February 21, 2011, mainland companies listed on GEM Tianlong photoelectric (300029) announcement, Jiang Suhua Sheng Tianlong photoelectric equipment Limited by Share Ltd (hereinafter referred to as "Tianlong photoelectric" or the "company") and Huasheng photoelectric equipment (Hongkong) Co. Ltd. (hereinafter referred to as "Hua Sheng Photoelectric") on February 18, 2011 signed the "Jiangsu Huasheng Tianlong photoelectric equipment Limited by Share Ltd and in Jiangsu Jintan Huasheng photoelectric equipment (Hongkong) Co., a joint venture of the joint venture contract", raised funds by Huasheng Tianlong photoelectric, photoelectric MOCVD to a number of proprietary technology and capital investment, joint venture established independent legal joint venture company in Changzhou, mainly engaged in MOCVD equipment and technology research and development, production and extension customer service, sales, and service, and the establishment of a joint venture to develop for the purpose of the subsidiary company in Shanghai. Dragon photoelectric raised 53 million 333 thousand and 300 yuan invested in the use of Hua Sheng Photoelectric intangible intellectual property rights into the conversion of RMB 35 million 238 thousand yuan and capital investment of RMB 6 million 666 thousand and 700 yuan. Tianlong photoelectric (300029) is the GEM companies dedicated to new energy equipment and its application, the main products include single crystal growth furnace, polycrystalline ingot furnace, wire cutting machine, led sapphire furnace, after nearly 5 years of development, the company has become the domestic important new energy equipment suppliers. In the next 3 to 5 years, the company will focus on the strategic direction of the photovoltaic industry and the LED industry, the new energy industry is the important direction of the new, committed to the development of these industries in the chain of equipment, manufacturing and application of the two industries, the use of the industry in the development of the industry, the development of the industry, and the application of the equipment in the two industry chain. Huasheng photoelectric is founded by a group of LED MOCVD in the field of technical experts and management personnel, a number of LED MOCVD technology has the innovation, with independent intellectual property rights, technology and experience and the team has a semiconductor thin film deposition equipment world-class large-scale production has accumulated 20 years of. Mainly engaged in LED MOCVD equipment, technology, the extension of the process of R & D, production, marketing and sales, and after-sales service. Mr. Chen Aihua is the legal representative of Hua Sheng Photoelectric, and the actual controller for Hua Sheng photoelectric. Chen Aihua, former American applied material company (Applied Materials) director general manager of the company products and LPCVD, executive vice president. From 1992 onwards, participation and leading the development of several generations of a series of thin film deposition techniques and equipment, including metal physical sputtering; MOCVD aluminum, titanium nitride, tungsten and tungsten silicification; silicon nitride, silicon and silicon oxide thermochemical deposition; and the successful introduction of the market, to promote the development of the world film deposition technology and equipment. With a long history of technology development, product management, intellectual property management, marketing and sales, human resources management, customer service, information management, and comprehensive decision-making management experience. Has 40 United States, Japan, Europe and China have 11 patents, patent pending. The three Award for outstanding engineering and invention. According to the project feasibility study report issued by the display, the strategy for the development of the core competitiveness of the joint venture company MOCVD equipment: a) to reduce the manufacturing cost of more than 35% chip epitaxial b) improve the extension required for large scale production equipment reliability, stability, safety and maintenance of C system) to provide high performance chip epitaxial process made with Aixtron compared with Veeco, the MOCVD system capacity can be increased by more than 30% units. The real-time temperature control of multi - independent heating element resistance type heater design and vertical uniform spray type separation reaction gas transportation and distribution of sprinkler system combined can effectively improve yield wafer rate, but also can solve the current Aixtron and Veeco equipment reliability problems in large-scale production and consumption is reduced in the presence of system maintenance and expensive reaction gas. In addition, the project uses a horizontal and vertical combination type gas discharge technology, can reduce the impurity particles, improve the quality of epitaxial thin film crystallization, which not only increase the yield, but also can reduce the consumption of expensive gas reaction. By reducing the cost of equipment and supplies through the above approach, the company MOCVD equipment and spare parts costs can be reduced by more than 30%. Project schedule plan by the end of 2012 years of joint venture products into the market, sales of 1-2 MOCVD equipment, to verify the performance of products and establish the brand of the product. In 2013, as only 3% of the domestic market, sales of 8 sets of MOCVD equipment, the scale of the industry will reach 100 million yuan; by 2014, 8.5% of the market, sales will exceed 450 million yuan; to 2015, such as market share increased to 15%, industrial scale more than 900 million yuan. The establishment of the company and began operating 2011-02 equipment and the overall design of the system and the main suppliers to determine 2011-05 complete equipment and systems for the detailed design of 2011-08 first prototype installation 2011-12 first chip epitaxial 2012-01 completed the first prototype and made production process development and strategic partners to develop 2012-02 customers and determine the chip extension required 2012-08 process complete equipment industrialization / production and implementation of equipment sales of 2012-10 sales in the first device chip manufacturers production line installation and debugging 2013-02 second sales of equipment in the production line installation and debugging of 2013-04 chip manufacturers