Light into a large enterprise into the forefront of technology advantages

Once a year the Guangzhou international lighting exhibition industry event has ended. Compared with previous years, this year's show, change the flavor is particularly strong. 2013 will be a watershed in LED lighting. Industry insiders say.

From the product point of view, the Guangzhou international lighting exhibition products more rich and complete, from the substrate, chip, package, light source, power drive, LED finished lamps to equipment, products covering the entire LED industry chain; at the same time, white LED lighting products increased significantly, bulb lamp, lamp, lamp, lamp and other Home Furnishing LED indoor lighting products more diversified.

From the point of view of brand building, LED lighting products have begun to appear differentiation, some exhibitors have a more complete product categories and scenarios show, and have a more clear professional orientation.

From the point of view of technology development, the flip chip technology has become a hot spot in this exhibition. Crystal Electronics as the only one mature application of Flip-chip technology in high power LED flip chip leading brands, this year launched a heavy attack "chip level LED lighting solutions, in the LED chip made in the process of the new wafer level process, part of a traditional packaging process or save the traditional packaging process. The final package size LED, the performance is more stable. For the flip chip technology, the chip level light source can avoid the use of traditional solid crystal, wire bonding process, to achieve the development of no gold wire, under the impact of reliability and high current, performance and cost performance is better.

At the Guangzhou International Lighting Exhibition, a series of products crystal electronics exhibition attracted a large audience, the flip chip technology will undoubtedly become the hot spot in the "easy" series, and COB ceramic products using APT patented technology - flip chip technology based on the single chip and multi chip modules without gold, non crystalline solid plastic package has many advantages of high brightness, high efficiency, high reliability, low thermal resistance, good color uniformity etc..

From 2003 onwards, Crystal Electronics began upstream of LED technology research and development research, completed in June 2004, samples of high power LED flip chip, RFID package and other series of technical development, March 2005 to complete the development of blue LED chip and flip flip chip module, manufacture and application of the first domestic enterprise and the most mature. On the eve of the opening of the Guangzhou International Lighting Exhibition, high-power Crystal Electronics without gold ceramic packaging products (Yi Xing 3535) and low power PLCC packaging products 3014 two products, the third party certification authority over 6000 hours of actual testing, were found to meet the energy star "America" (Energy Star LM-80) standard. In the flip chip technology, Crystal Electronics has long been focused on R & D for many years, in the beginning has been a step ahead of the industry.