LED the price pressure is not reduced the chip package without menacing

LED lighting industry into the era of continued downward pressure on the LED factory to invest development of chip package, LED Philips, Lumileds Toshiba, Taiwan factory product of solid-state lighting, crystal electric and canyuan free chip products have been launched, following the ELC (Embedded LED Chip crystal electric) technology and canyuan (Package PFC Free Chip) debut, Philips Lumileds Chip Scale Package (immediately launched by wafer level chip size package) technology, and for the first time has flip chip (flip-chip) for high power LED package LUXEON Q has been developed based on the non chip packaging technology is undoubtedly a major focus of the industry in 2013.

The LED lighting product process, divided into Level 0 to Level 5 in the manufacturing process, among them, 0 Level for epitaxy and chip process, while the Level 1 LED chip package, Level 2 is LED welding on PCB, Level 3 LED module, Level 4 is the lighting source, and Level 5 is a lighting system. LED factory packaging chip technology in order to omit the development of Level 1.

Philips 2013 Lumileds amplification product line step actively, in addition to the layout of the low power line, also recently announced the launch of high power LED package LUXEON Q, this is Philips Lumileds for the first time in flip-chip for high power LED based technology developed by PHILPS Chip, and Scale Package (wafer level chip size package) technology.

Philips Lumileds's new LUXEON Q using CSP technology and flip chip technology to achieve high power and high luminous performance, it is understood that Philips Lumileds the previous generation of thin-film flip-chip technology in the BEOL will be removed and the sapphire substrate, LUXEON Q uses a new generation of flip-chip technology, do not need to be in the BEOL remove the sapphire substrate. LUXEON Q lock directly replace the market has been quite familiar with the 3535 series products of mature application, including the application of patio lamp, down light, wall lamp, lighting and special lighting application of replacement type.

Taiwan LED chip factory in the chip package without product development pace also actively, EPISTAR ELC new products used in semiconductor manufacturing, will save the package (Level 1), including lead frame, wire in the past do not need, leaving only the chip collocation fluorescent powder and plastic packaging use, and can be directly mounted (SMT it is reported that the use of), the supply chain has to enter the crystal electric backlight ELC products, the future will also be used for lighting market.

Canyuan also developed the PFC package free products, the use of flip chip design based on the chip does not need to hit the line, PFC free chip package product has the advantage of light effect to 200lm/W, light angle greater than 300 degrees around the ultra wide angle optical design, and can not use the two optical lens, will reduce the consumption and cost the effect of light.