LED market pick up, optimize the packaging manufacturing process imminent

Benefit from the rapid expansion of the downstream application market, LED industry began to pick up from the second quarter of this year, from the lighting application, and strong demand for mobile phone, tablet computer, large size TV backlight market, to promote the LED packaging industry in the production scale and the manufacturing process of a new round of innovation. The LEDinside report shows that in 2012 the global LED package is roughly $10 billion 280 million, is expected to 2013, this number will increase to $11 billion 270 million, an annual growth rate of 9.6%, the LED package used in the lighting field will further enhance the proportion to 26.4%, around us $2 billion 980 million.

From the market application, the LED packaging products in large quantities or in the SMD patch type, due to the impact of price factors, the use amount of small and medium power products more, not much change in the types of packaging, but the specifications and standards to slowly shrink, the track of development. Especially for the current popular lighting application development, Jiangsu Wenrun photoelectric Limited company deputy general manager Zhou Feng pointed out that the LED light source costs account for about 30-40% of the whole lamp, the market is more sensitive to the price factor in market competition and cost considerations under the action of the LED package is from the original small power gradually to the high power expand the original, commonly used 0.06W to 0.2W or 0.5W or even higher, single light flux from the original 8 to the current 23 lumens lumens, 55 lumens or even higher.

In product supply, manufacturers have said that the LED package prices experienced a rapid reduction of the last two years later, in addition to the lighting market price faster than, for a period of time of packaging products prices will slow down, the market remained stable. Placed in front of all packaging enterprises is a topic, how to meet the needs of efficient, cost-effective? It requires LED packaging volume reduction, better light quality, is conducive to heat dissipation, and a single LED must be able to operate a higher wattage. In this trend, the optimization of packaging technology and manufacturing processes, improve luminous efficiency, and reduce the production cost of LED packaging, has become the main direction of the development of the industry.

COB package officially entered the practical stage

For the two LED backlight, lighting market driven engine in the LED package needs not only exist in common, and constantly improve the light efficiency, and the best cost-effective products; at the same time also have different requirements. Crystal Electronics (Guangzhou) Co., Ltd. application development director Chen Haiying analysis, the backlight market demand for LED packaging, but also in the increasingly high demands on the single luminescence intensity, which causes the input power is more and more single package device, the luminous flux emitted is also growing, this is from the backlight the above scheme reduced the cost of demand. To this end, LED devices need to improve the heat resistance of the material to meet the high power input reliability assurance, and enhance the ability of the chip to withstand high current shocks, to meet the high light output performance of a single price conditions.

"In addition to the luminous efficiency requirements of LED per lumen (lm/$), the light quality requirements are increasing. Light quality performance into two aspects, one is the color of the light color, with the sunlight spectrum similarity degree; the other is the two lamp light distribution requirements, to meet the lighting, illuminance, glare, spot uniformity etc.. The spectral quality needs to promote the progress of packaging materials and packaging technology in the light of the color quality of the light distribution, and demand more impetus to the penetration of COB this product form in the lighting inside, especially the COB package to further compress the chip manufacturing process between the light engine, so the product price increases. Crystal Electronics (Guangzhou) Co., Ltd., said Chen Haiying, director of application development.

At the same time, LED lighting terminal products demand for high wattage is obviously a trend. Everlight Limited by Share Ltd R & D products business management office director Jin Haitao pointed out that as the market increasingly high demand for high wattage and light quality, the COB package is currently used in the lighting market gradually occupy the mainstream position. Especially in the day of the lantern, and spotlights downlight, COB has many advantages such as light source for single direction light source products, and can achieve high wattage or high voltage, it can better meet the design requirements of high efficiency, single source, and in effect can also highlight the similarities with the traditional light source.

In the actual product development, stage lighting package has been in photoelectron billion from the low power component general gradually turned into the form of COB, the existing 3~25W COB series can not only directly lock on the heat dissipation module, and then save the SMT step, also through the luminescence area, low resistance and low current density to provide cooling more space, more convenient to assemble on the lamp, creating a lower cost structure. According to reports, Everlight COB series have been tested by LM80, in order to show the performance of its durability and high efficiency, the future in product planning, Everlight Electronics will focus on emphasizing high efficiency, high color, high pressure and high cost etc..

Crystal Electronics in the gold technology platform based on flip chip technology as the core development direction, this year the company launched the strike "chip level LED lighting solutions", namely in the LED chip made in the process of the new chip technology, a part of the traditional packaging process or save the traditional aspects of the packaging process, the package size the final LED is reduced, the performance is more stable. Its easy system