LED lighting spawned new opportunities for high thermal conductivity substrate

The rapid rise of white LED lighting, both in the application market or in manufacturing technology has shown a rapid development momentum. At the same time, the industry has led to the rise and development of a new generation of LED materials technology, one of which is used for LED thermal conductivity substrate. At the same time, it also opens up a new market space for high thermal conductivity substrate material industry.

Large thermal conductivity substrate Market

The role of the thermal conductive substrate in the LED cooling is becoming more and more important, and it gives birth to a new market opportunity.

LED with environmental protection and energy saving, has a rapid development in the lighting field as an optoelectronic device, its working principle is actually a photoelectric conversion process, the input power part will be converted into energy, which can be used for lighting. However, the rest of the energy will be converted into heat, which will cause the LED chip temperature rise. The effect of temperature rise on the LED chip is very large, which will reduce the luminous efficiency of LED and shorten the service life greatly. So how to achieve effective heat dissipation has become the most concern of LED manufacturers. In this regard, Fudan University professor Fang Zhilie pointed out that LED thermal management, including chips, packaging and systems and other levels. At the chip level, people can improve the internal and external quantum efficiency of the chip, and enhance the ratio of light energy conversion of the LED chip, so as to reduce the generation of heat energy. Generally speaking, LED can be used to heat the substrate, such as metal substrate and ceramic substrate.

The output power of LED in recent years more and more high, more and more than 1W high power application range of LED, solve the problem of heat dissipation has become the industry standard development, played in the LED thermal conductivity substrate in a more and more important role, while also creating a significant market opportunity. According to PIDA (Taiwan PIDA) survey, the global LED heatconducting substrate market sales in 2010 of about $855 million. From 2009 to in the past 4 years, the global LED thermal conductivity substrate sales average growth rate of up to 30.02%.

Ceramic, resin substrate began selling

Higher thermal conductivity, greater flexibility and better performance to price ratio, is the main direction of the development of LED thermal conductivity substrate.

Heat conduction substrate cooling is an important part of LED thermal management technology, and its technical development trend is affected by the demand of LED market. In general, the higher thermal conductivity, stronger application flexibility and better performance to price ratio is the main direction of development.

High power LED is the mainstream of the current lighting market. However, because of the larger heat transfer, it is necessary to have higher thermal conductivity, heat resistance and stability. In this regard, Xin Sen Sen photoelectric (Shenzhen) Co., Ltd., general manager Li Fengming told reporters that the current LED thermal conductivity substrate is basically divided into printed circuit board (PCB), metal and ceramic substrates, such as several major categories. Generally low power LED due to little heat, heat dissipation is not serious, so long as the use of the general PCB board to meet the demand.

However, with the increasing popularity of high power LED, PCB is not enough to meet the cooling requirements, the need to attach a printed circuit board on a metal plate to improve its heat transfer path. The metal substrate is made of aluminum or copper. Because of its mature technology and cost advantages, it is widely used in LED lighting products. However, with the pursuit of higher heat dissipation effect, the better performance of the ceramic substrate has been developed, and is increasingly used in practice. Ceramic substrate AIN, higher thermal conductivity, about 170 ~ 240W/m ~ K, thermal expansion coefficient of 3.5 ~ 5ppm/K. But the cost of materials and processing costs are high, so the price is more expensive, such as large-scale procurement will not be suitable for application. Li Fengming said.

The LED package requires not only can protect the LED chip, but also light, while also considering the special design requirements and Application module of the link, so the future of LED encapsulation materials flexibility requirements will become more and more high. Heat transfer substrate companies are also increasing emphasis on this demand. For example, in the development of LED conductive substrate, Matsushita Electric Works on the development of organic resin substrate materials with high thermal conductivity and flexibility. Matsushita Electric in January 2009 to the market launch of a high thermal conductivity of glass fiber cloth - organic resin composite type copper clad laminate EcooLR-1787". The thermal conductivity of the product is 1W/m, K, thermal resistance is 6.7 /W. At the January 2012 Tokyo lighting show, Panasonic has demonstrated a new generation of EcooLR-1586.

According to the introduction of Matsushita Electric NL business department Shida Yuriko, EcooLR-1586 thermal conductivity increased to 1.5W/m, K, thermal resistance of 5 /W. EcooL is a type of organic resin thermal conductive substrate with substrate material, its class and metal in the performance (such as aluminum), compared to Tao Ciji high thermal conductivity substrate material, has a higher degree of freedom in design, convenient processing and flexible features, while it is in the high voltage resistance, metal ion mobility also can compete with other high thermal conductivity substrate materials.

In addition, the cost price is related to the LED terminal products can be accepted as an important factor in the market, the current price of LED lighting products compared to energy-saving lamps, incandescent is still high. How to find a solution to the trade-off between heat conduction and cost is also the direction of industry research and development. The east new energy (Suzhou) Limited Hashi Junyuki said, about LED lighting, we believe that companies generally of high power, high brightness products have a very high enthusiasm, but such products for the general consumer price is too expensive, unfavorable