LED industry needs to work together to strengthen the upstream and downstream

July 5, 2013, under the guidance of the Ministry of industry and information technology electronic information division, China semiconductor lighting /LED industry and application alliance, China Electronics News in Beijing hosted the China LED Supply Chain Conference in 2013". The conference to all aspects of the LED industry and win-win cooperation, collaborative development as the theme of in-depth discussion from the Ministry of information industry and electronic information division, Beijing City letter by the Leadership Committee and other departments, LED epitaxy and chip manufacturing, packaging, product application, special equipment and materials industry chain enterprises nearly 200 people attended the meeting. This newspaper excerpts from the main ideas to readers.

Technological innovation drives application requirements

In the field of traditional LED display, all kinds of indoor and outdoor LED display screen key technology is mature, the product of the machine in the reliability and technical level of continuous improvement and perfection, formed a series of standardized products. The overall direction of technological innovation industry mainly concentrated in large screen high density display control, new product development, engineering design, project special shaped LED display application development products and product reliability, energy saving etc.. At the same time, full-color indoor and outdoor display screen has been widely used, outdoor high definition full color paste technology and products are increasingly mature.

With the continuous innovation of technology, the development of the upstream industry of LED has a significant effect on the development of the display application industry, and it can be used to improve the ability of comprehensive engineering and technology to meet the special needs of major projects. The indoor high density and small pitch LED display challenge DLP rear projection and LCD, from P2.5 to P1.8 to P1.5, widely used in various industries, road traffic police command, radio monitoring, power system, military, water conservancy, city management etc.. In the June 2012 European Cup, the Chinese LED display companies once again demonstrated the style of China's LED display products, and once again let the "made in China" stand on the center of the world stage. 2012 Spring Festival Gala, composed of LED display 360 degree dream stage, presents a visual feast.

Therefore, the entire industry on the demand for material devices have also changed. In the aspect of chip devices, the requirement of the device is improved, and the wavelength is small, the color consistency is strong, the antistatic ability is strong, the reliability is high, the cost performance is high, and the cost control is convenient. In the drive components, the refresh frequency and intelligent control has higher requirements. In the power system, the requirements of energy saving, reliable, redundant backup can be achieved.

Urgent need to promote the promotion of industrial chain

The advantages of HV chips is mainly manifested in the following aspects: reducing the number of chip solid crystal, wire, reduce the probability of failure, reduce the packaging cost; single chip to form a plurality of microcrystalline chip integration, avoid the consistency between the BIN wavelength, brightness voltage, span the problems brought by the high voltage chip due to work; the easy packaging finished working voltage close to power, improve the conversion efficiency of the power supply; low operating current, reduces the product in the application of line loss; small current driving, high light efficiency, reduce the heat stress; without transformer, avoid the energy loss of the transformer, reduce the cost, save the drive space, convenient lamp design.

GaN based LED has made unprecedented progress in the field of lighting, and its light efficiency and price is the key factor for the rapid promotion of LED. LED is the main structure of the GaN based LED, which is simple structure and low cost. China's Taiwan EPISTAR launched the first HV LED, the luminous efficiency can reach more than 160lm/W. The source of the mainland of China in the light of the mainland to achieve the first HV chip production, the development of the HV chip package, the light effect of more than 110lm/W. However, the current HV chip is not a large area of popularity, packaging companies need less HV chips, and the overall layout of the HV chip applications can highlight the advantages of HV chip. Therefore, the HV chip production and the production is just one aspect, more important is to combine with the design, packaging, application and other aspects, good docking customer and end application and matching work, in order to make the HV chip can be used widely.

The traditional structure is still the mainstream of the current structure, the main structure of the future is not clear. The HV LED makes LED lighting design further simple and light, in line with the direction of the development of lamps, is expected to become an important part of the future LED chip market.

New packaging with stress

The silicon substrate vertical chip using silver as P electrode, compared to sapphire chip using ITO P electrode, conductive performance increased more than 10 times, so it has good diffusion characteristics of current, has the characteristics of low voltage, high luminous efficiency, can work under big current. The thermal conductivity of silicon is 5 times as high as that of sapphire, and the good heat dissipation makes silicon substrate LED with high performance and long life. At the same time, silicon has the ideal thermal ductility, high temperature can still maintain good reliability. In addition, the silicon substrate can be achieved without any damage, and the stress of the substrate and gallium nitride material layer is eliminated. Its N face up, one side out of the light, no side light, luminous morphology for the Lambertian distribution, easy to match the two optical, more suitable for directional lighting.

Based on this, the silicon substrate vertical chip in the packaging, the general use of ceramic substrate as the thermal conductivity and electrical carrier, can obtain superior thermoelectric effect. The bottom gold plating is suitable for silver paste solid crystal process. The P electrode and the appropriate substrate contact, low thermal resistance, resistant to high current use. Welding line is short and short, stable performance. Molding optical Lens can be selected from 30 to 140