LED development and development of high brightness LED wafer level packaging process

About LED lighting market in Asia Pacific region, Oxford instruments (Oxford Instruments) in 23, officially stationed in ITRI MEMS laboratory established R & D Center for HB-LED (high brightness LED) after the wafer level packaging process and integration of micro structure technology, common development improvement of the new technology, the future is expected to transfer to. Manufacturers in Taiwan, accelerate the upgrading of the LED industry competitiveness, it is reported that there are a number of LED packaging manufacturers keen interest, expected in the near future silicon substrate packaging technology will appear great breakthrough. Different from the current in the ceramic substrate, the silicon substrate wafer packaging process using the powerful challenge to the traditional packaging process, the semiconductor industry to the background of TSMC's packaging factory caijue represented, specializing in wafer level high power LED package technology of silicon, and locked in the LED lighting market, because silicon the substrate heat conduction effect, wafer level packaging can shorten the original process, and mass production has the advantage of reducing the cost, the wafer level packaging technology menacing, is regarded as a very competitive rival technology.

ITRI President Xu Juemin said that the MEMS technology is the key technology for LED today after the wafer level packaging process in MEMS laboratory, research institute by the Ministry of economy long-term support, Taiwan is currently the only with 2~8 inch MEMS wafer process technology research and development laboratory, can help the industry design, manufacturing, packaging, test and trial production service etc..

The Industrial Technology Research Institute and Oxford instruments cooperation, will accelerate Taiwan manufacturers in the LED wafer packaging technology? X seal to enhance the competitiveness of products, the future high brightness of the LED industry, ITRI will gradually development planning, micro nano electromechanical key process technology, and make Taiwan LED and micro electromechanical industry chain more complete.

The Institute said that the added value of wafer level packaging process, each different in design and application technology are now one with a number of LED packaging factory or related industry contact, is expected to be published in the latest technology breakthrough in the short term, and with the industry of technology transfer authorization.

Oxford instrument group president Jonathan Flint said the Oxford instruments focus on plasma etching and chemical vapor deposition technology for more than 25 years of experience, LED offers upstream epitaxial substrate and patterned middle grain manufacturing key leading equipment, and in cooperation with the global LED manufacturers for the first binary process development, solve the problem of LED heat dissipation technology downstream. Because of certain region as the world economy, talents and market as well as the abundant artery, ITRI LED R & D energy and talent, especially overseas R & D center was established in ITRI, and the nearest service = LED manufacturers too demand areas.

Oxford instruments said that this trip will also seek for Taiwan manufacturers to become the machine parts suppliers, the equipment settled Asia, reduce the equipment cost and accelerate the play time machine, hope that the future development of Taiwan as a regional machine assembly center.

Said the Ministry of economic affairs, Taiwan, Britain since the March 2010 opening of direct flights, the two sides to speed up imports of goods, and to promote business exchanges, making Taiwan become Britain in Asia Pacific trade station, and in the ECFA bonus, foreign will be able to use Taiwan as a regional R & D base, assembly center and transportation center, combined with the Taiwan supply chain, to enter the mainland market.