Konka capital increase Rui photoelectric, cross foot LED field

Konka recently announced, will through its wholly owned subsidiary, Dongguan Konka Electronic Co., Ltd., invested $22 million 500 thousand shares of RMB equivalent enraytek Optoelectronics Technology (Shanghai) Co., Ltd., investment will hold 36% stake in enraytek optoelectronics, but this investment does not have a controlling position, is to ensure that the light emitting diodes (LED) supply, Ying Hongkong Hao Teng Rui optoelectronics company and its management team is responsible for operation and management.

Enraytek optoelectronics company due to expand the scale of needs funds, intends to increase Konka and other investment institutions. Dongguan Konka Electronics Co., Ltd. and Hongkong Hao Teng Co., Ltd., Beijing Beida Jade Bird Universal Polytron Technologies Inc, SBI & BDJB TECHNOLOGY LTD signed the equity transfer and capital increase agreement. Dongguan Kang company, prize.the company and SBI company jointly agreed transferee stake held by Hongkong E-hand enraytek optoelectronics company, were holding 36%, 18%, 16%, at the same time, Dongguan Konka, Beida Jade Bird SBI company and capital of enraytek optoelectronics company. After the capital increase, Ying Rui photoelectric registered capital increased from $10 million to $50 million.

Enraytek optoelectronics and Shanghai port group to jointly build a national LED industry demonstration base in Shanghai Lingang Industrial Zone, the project total investment of about 2 billion 700 million yuan, with an investment of about 1 billion yuan, the project will cover the LED industry in the upper and middle reaches of the key link, the scope of design, R & D and manufacturing covering manufacturing, substrate materials, wafer, chip packaging and testing to LED from sapphire crystal, products will be used for the LCD TV backlight module, general lighting and other fields.

Enraytek optoelectronics currently plans to build 1 Plants in China, and according to the needs of the market gradually establish and expand production capacity. The first phase of the project and the project has started construction in August 2010, the capacity of the project is expected to produce 40000 pieces of substrate, epitaxial wafer of annual output of 200000, with an annual output of 2 billion pieces of chip package, with an annual output of 2 billion, the project is still in the construction phase, has not yet achieved income.