Inverted LED popular CSP era is no longer remote

Crystal Electronics announced that it will exhibit CSP products in the June light Asia exhibition. It is reported that CSP in 2007 by Philips Lumileds, has been no progress until 2013 LED industry to become the most talked about technology, so far, only in the topic, almost no real display products.

Of course, this is not without reason. Although the CSP technology has been in the semiconductor industry for years, but it still belongs to advanced technology, which is in order to reduce the package volume, improve the problem of heat dissipation and improve the chip reliability, and the industry is the traditional CSP technology will be defined as the same package volume and LED chip (referred to as: "wafer level package"), or volume more than 20% LED chip package, and complete function.

Although the advantages of the technology itself for the cost control of the industrial chain is obvious, but the cost of production and yield is still the biggest consideration. With the layout of foreign giants in the domestic trend of the CSP, the domestic enterprises have a deep sense of danger. The crystal section of the CSP products on display, does it mean that the domestic CSP technology has overcome these problems, can compete with foreign giants on the same stage?

CSP popular upside down

Crystal Electronics launched CSP, in fact, has its reason. Because of the development of the CSP market, is inseparable from the flip technology, and why?

The chip scale package technology mainly has three kinds: one is the technical scheme of LED wafer dicing, then flip chip mounting to a circuit substrate material has been produced, and other packaging process, finally dicing, lobes are obtained one or more of a LED module, which is more popular. The technology is relatively mature.

Second, the LED wafer metal after the dicing making LED flip chip, and then put it above the LED flip chip and four side fluorescent material coated layer and achieve the purpose of encapsulation, can be directly to the downstream customer application lamps. This method is a common practice in the market, but also the direction of the development of various LED plant.

Third, LED epitaxial films by metal electrodes after the completion of phosphor coating directly on the crystal cylindrical, after cutting and splitting implementation of chip scale package, the process technology is difficult, is still in the early industrialization.

In the three method, the core of chip level packaging is the development of flip chip.

As for the development of the flip chip, according to industry research report showed that in 2014 the city accounted for more than LED flip chip just over half of the vertical, and forecast to 2016 grow sharply to 24% of the proportion, directly endanger the vertical LED chip market position.

With the increasing market share of the flip chip, more and more domestic investment LED flip chip enterprises, technology is also more and more mature, which will accelerate the development of CSP.

It is reported that the current foreign CSP giants PHILPS, CREE and Samsung have the layout of the domestic, and domestic enterprises to set up offices, sferic, BDO Runda, crystal, and other LED companies launched CSP products.

Has been optimistic about the development of CSP stereo photoelectric general manager Cheng Shengpeng at the signing of a cooperation agreement with Samsung said that 2015 is the first year will be free package application chip, within the next two or three years that no packaged chip will be popular. At the same time, Samsung Tang Guoqing also said that Samsung CSP will be the focus of the development of products in 2015.

The emergence of new things will always be controversial, of course, CSP is no exception. So, there are those who say that the industry is not optimistic about the development of CSP, CSP will not be popular, perhaps only to the market to verify the most appropriate.

Shorten the industry chain to achieve the price close to the people

Since it can not change the status quo, it is only to change themselves to adapt to this situation. In the face of LED lighting products prices have become the norm in the industry, as LED, how to change their own to adapt to this situation?

CSP may be the final product of the price war, change to adapt to the price of LED tide. Although the current CSP promotion difficult problem, the main reason is that the existing equipment can not be used, need to re investment, but the terminal market is considered cost-effective.

When CSP does not affect the original performance of the LED stable, but beyond the existing LED products, the terminal market can not be shut out, so it is bound to force the upstream and downstream enterprises to switch to CSP.

CSP why is the future trend of LED? There are three reasons.

First of all, from the performance point of view, due to not only solve the development and improvement of heat dissipation package volume miniaturization, simplification, and can realize the miniaturization of the package of individual devices, each device can greatly reduce the material cost, so to achieve mass production capacity greatly.

Secondly, from the existing development model, the development of the industry from the "chip factory + + application package factory" mode to "chip factory + application business model, save the package link, shorten the chain, will reduce the cost of circulation, let LED price closer to the people.

Finally, from before the packaging process, high power package based on thinfilm chip, the chip is bonded to a ceramic substrate, then the fluorescent powder coating, and the low power package is more of a level of chip based, using wire frame and winding process or QFN package type, for in the way of spraying fluorescent powder. The CSP technology for high power and medium power package to bring a new choice. (text / China LED network SKavy)

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