Inventory of hot technologies in the LED industry in 2013

Unconsciously, to the end of the year, looking back on 2013, LED market gradually pick up, the rapid development of the industry, innovation. The LED market continues to introduce new technology, new technology is new hot words. EMC, flip chip, flip, packaging, such as off the technology market climax. In addition to the old and new opportunities this time, LEDinside with you to count those worthy of historical memory of the new technology.

EMC encapsulation

EMC Chinese name for epoxy molding material, also known as epoxy molding plastics, IC (Integrated Circuit) is one of the main raw materials in the manufacture of packaging. With the development of IC packaging technology, EMC as the main electronic packaging materials has also been rapid development. EMC has the characteristics of high reliability, low cost, simple production process, suitable for mass production and so on. It occupies more than 97% of the market. Now, EMC is the tentacles extended to semiconductor devices, integrated circuits, consumer electronics, automotive, military, aviation and other packaging areas. Because of its excellent heat resistance and suitable for large-scale modern production, EMC provides an excellent solution for its application in LED packaging.

EMC is a framework with a highly integrated modified Epoxy material and etching technology in Molding device package under the etching copper substrate such that Epoxy has a larger contact area with the copper substrate holder, and compared with the PPA thermoplastic EMC adhesion is strong, the EMC product in anti moisture and richly endowed by nature the red ink penetration advantage, the package from the IC package, but also different from the IC package. Due to the change of material and structure, the EMC products have the characteristics of high heat resistance, anti UV, high integration, high current, small size and so on. Especially significantly enhance the anti UV performance, the application of EMC products have greatly expanded, can cope with the outdoor lighting and automotive lighting and damp environment, will form a favorable impact on the mature high-end ceramic packaging products.

EMC because of its high heat resistance and highly anticipated, for the pursuit of cost-effective, the use of ultra current in the LED industry has become a consensus, but also the use of super current risks and opportunities, the biggest risk is the heat treatment. At present, the industry EMC general packaging process is: the use of formal / vertical structure, small power chip, low thermal conductivity of the insulation adhesive as the chip adhesive, and then welding wire, point powder, cutting in order to achieve the production of finished products.

EMC (Epoxy Molding Compound, thermosetting epoxy resin) has not only led to supply power of the Taiwan LED factory EPISTAR, Everlight, Lunda, East Bay, new century greet the season in the third quarter of this year, also let Taiwan factory in mainland China and the United States CREE lighting market compete.

The mainland lighting factory looking for alternative materials, EMC as the concept of technology has become the best choice package support cost-effective, with Taiwan LED supply chain factory to quickly launch related lead frame, chip, package products, and the successful delivery, and can effectively reduce the cost of the finished single lighting up to 2 ~ 5, also contributed to this wave EMC in the second half of the year is expected to become the mainstream technology, lighting factory.

flip-chip

Flip chip is referred to as "flip chip" as compared to conventional wire bonding (WireBonding) and post implant processes. The traditional wire bonding with the substrate is connected to the substrate, and the electric face of the flip chip is equivalent to the former".

The essence of the flip chip is on the basis of traditional technology, the chip light emitting region and electrode area is designed to mount the lamp at the bottom in the same plane, then by the electrode area facing, this process can save the welding line, but on this solid crystal process of high precision, is generally difficult to achieve high yield.

Advantage: the GaN based LED structure layer is grown on sapphire substrate by MOCVD technique, and the light emitted from the P/N junction light emitting region passes through the P region. Due to the poor conduction performance of P type GaN, in order to obtain good current expansion, a metal layer with a layer of Ni-Au was formed on the surface of the P region by evaporation technique. The lead of the P zone is led out through the metal film. In order to get good current expansion, Ni-Au metal electrode layer can not be too thin. To this end, the luminous efficiency of the device will be greatly affected, it is necessary to take into account the current expansion and light efficiency of the two factors. But no matter under what circumstances, the existence of the metal film, always make the transmission performance worse. In addition, the presence of the lead solder joints also affect the light efficiency of the device. The use of GaNLED flip chip structure can fundamentally eliminate the above problems.

Due to the high power commercial lighting gradually to the high current, high brightness, integrated development, packaging technology, with the vertical gold dress chip chip has some unavoidable disadvantages, such as gold weld, surge resistance, large flow capacity, thermal expansion and contraction caused by silica encapsulated gold and gold in the process of fracture yield and other issues.

Packaging technology

Dr. Chen Zhengyan said the new century R & D center, packaging technology is not only the integration of technology, rather than let the package disappear, basically packaging. Personally, as long as the process is to achieve a white light blue phosphor. As for why the packaging technology on the market, the reasons for the heat, Dr. Chen said that because of the package without eliminating some of the links, is to make the lowest cost of finished products technology.

PFC packaging products, the use of flipchip based chip design