Improve the packaging industry chain Alex Hua Tian intends to purchase 51% stake in the Mike

Alex Hua Tian Technology (002185) April 28th evening announcement, the company in April 28th with Chen Sunan, Mike, Fu Lun, photoelectric signed a cooperation framework agreement "capital", the company intends to capital Mike photoelectric in cash in two phases, increase the total amount of 50 million yuan. After the completion of the capital increase, the company will hold 51% stake in Mike optoelectronics. Future Ltd will be based on the results of the performance of Mike, the company believes that the right time to acquire all or part of the shares held by the remaining shareholders of optoelectronics, Mike.

Wing Wai holds 100% stake in Mike optoelectronics. Chen Sunan control wing global 100% stake in the actual controller for the Mike photoelectric. Mike photoelectric 2014 and 2015 1-3 operating income was $96 million 143 thousand and 500 and $11 million 370 thousand and 700, net profit of $766 thousand and 200 and -76.61 million.

Mike photoelectric mainly engaged in LED backlight packaging and LED lighting R & D and production. Products are mainly exported to Europe, America, Asia, Australia, the Middle East and domestic markets, widely used in mobile phones, digital cameras, portable DVD, GPS and indoor lighting, etc.. Mike photoelectric company capital and the realization of its holding company in the packaging field can improve the industrial chain, to further optimize the industrial layout, enhance the company's market competitiveness and development strategy to achieve the company in packaging field.

The company also disclosed a quarterly, the first quarter of 2015 the company achieved operating income of 737 million yuan, an increase of 13.20%, net profit of $64 million 265 thousand and 300, an increase of 31.26%. The company expects 2015 1-6 attributable to shareholders of listed companies net profit range of 167 million yuan -2.09 billion yuan, net profit margin of 20%-50%. The main reason for the changes in the performance of the company to raise funds to invest in the implementation of the project, the company's integrated circuit packaging capabilities continue to improve.

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