Honglitronic: in the face of the CSP package to revolution?

China LED network news] package in the face of CSP when the revolution? "In June 11th, sponsored by LEDinside, China LED network and the Guangzhou International Lighting Exhibition LEDforum 2015 Chinese international LED market trends Forum, general manager of Liening honglitronic Lei threw out this package and the whole LED industry chain is a very concerned problem.

Where is the advantage of CSP? Relinin said, "it is more suitable for large current, small volume, the higher lumen density; omitted process line, improve product reliability; high package density and high production efficiency; the best part is the application of a more flexible, can be combined freely. "

For this reason, more and more manufacturers are keen on the development of CSP technology. In recent years, giant Samsung crystal power, Lunda, new century, such as the introduction of related products have sferic chip. So, the problem has come, since the chip manufacturers in the chip will be swept the CSP, if the package factory no new progress, then the future of the chip factory and packaging plant can play happily? The life of the packaging factory is really "leather"?

Honglitronic general manager ray Liening

Of course, in order to be able to play all the manufacturers and chip packaging factory, who did not dare to slack, crystal, etc., Hongli packaging factory have also developed related products. "We have to look directly at the CSP and we are also making technical breakthroughs and efforts," he said. "Reilly Ning Tan Chen, CSP packaging technology is facing many difficulties, including the difficulty of different packaging process, how to select the process, how different process performance to optimize, CSP the size of the products are diversified, how to achieve a standardized promotion, there has a breakthrough in this process a series of problems.

However, this series of problems have also brought hope to the packaging industry. Relinin said that the emergence of CSP will bring more changes to SMD, COB and other products. He said, COB current share is not very high, may account for only 15% - 20%, but the arrival of CSP will bring different changes to COB. "And for SMD products," with SMD 0.5W as an example, we have a preliminary estimate of the CSP products on the basis of existing savings will be 20% - 30% of the cost. "

Relinin said, CSP in different fields are gradually applied, the advantage of CSP is smaller, thinner, lower thermal resistance. Based on these advantages, the development of it in the field of general lighting, backlighting subsequent field has not.

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