High power ceramic package attack domestic trouble and foreign invasion in an embarrassing situation?

In 2008, when LED started to get involved in the packaging industry, display and backlight market, with CREE as the representative of the European and American international companies rely on their own advantage in high power chip technology, the full development of high power ceramic package source, occupy the outdoor lighting and other high-end market, the product was record high light efficiency.

The mainland has always been good at packaging enterprises and actively pursued the imitation of foreign advanced technology to sit, in the consolidation of existing display and backlight and other fields, have set their sights on high-power lighting enterprises occupy the market of Europe, in order to eat the cake. Although each high power ceramic packaging line equipment investment as high as about 10000000, there are still many funded enterprises not hesitate to drop down, before and after 2011, the company launched the ceramic packaging line size is 20, which is a typical representative of sferic, country star, Rui Feng, Hongli and other listed companies. But the reality is always cruel, over the past 4 years, the market is still hard to find, high power ceramic package light trail, more than and 20 ceramic packaging line most in the idle state, in addition to the individual companies to get government subsidies, the ceramic packaging business benefit is almost negligible, became the original ceramic packaging industry advocates of the pain in my heart.

Why would such a situation? By visiting the industry, can be attributed to three major internal factors, a major external cause, the author here in detail as follows:

One of the reasons: poor mainland brands, domestic and foreign market acceptance is not high

Imitation is imitation, the hearts of the people always feel that the authenticity of imitation is not authentic high. CREE and other international manufacturers in high power ceramic package has been for several years, the brand has been deeply imprinted in the minds of consumers, CREE has become synonymous with high power ceramic package source, its brand position is the domestic packaging factory in the short term can not shake. A typical example is the application of domestic manufacturers in the outdoor lighting, landscape lighting and other government demonstration project bidding, should be specially marked by CREE led to increase the winning probability. On the other hand, the mainland packaging manufacturers, even listed companies, in the field of high-power lighting is also known by nameless, not recognized by the domestic consumer groups, not to mention the United States and other international markets.

Internal two: packaging technology is not mature, the process of high scrap rate

Learning is the need for a process, to buy the equipment does not mean to buy the technology, which is experienced several years of suffering domestic ceramic packaging advocates lessons learned. The project started after the technical difficulty of the ceramic package to allow the original advocate, eat bitterness, chip localization, eutectic welding, phosphor coating, silica gel molding, cutting section, photoelectric measuring everything not to worry. Positioning is not allowed, the eutectic layer hole, chip stress cracking and other issues, on the one hand, bring about reliability risk, on the other side of the lead to high scrap rate, which makes the packaging practitioners broke their brains.

Internal three: chips, substrates and other key raw materials rely on imports, high cost

Dug talent is not equal to dig to service, which is also a profound lesson learned by the mainland packaging practitioners. Mainland companies found that even dug up CREE's technical team, but did not bring the quality of raw material supply services, this problem is very obvious in the chip and substrate source.

As the core component, the cost of high power chip, which accounts for more than 50% of the total cost of raw materials, has an important impact on the price of packaging light source. Then, the reality is that LED power chip has been mastered in CREE and other European and American manufacturers hands, low prices, the single source problem has plagued the domestic packaging companies, whether sample development or production, chip delivery is very long, the price is high, resulting in ceramic packaging production scale has been limited. Other domestic chip manufacturers or limited to three technical difficulty, or considering the risk of patent infringement, the past few years to focus only on the low power chip, high power chip market is too busy, the high-power chip packaging manufacturers is completely dependent on imports, quantity and quality are heteronomy, no room for negotiation.

Similarly, the eutectic ceramic substrate is matched with the chip, has been in the hands of the Taiwan Tongxin and other manufacturers, high price, long period, poor service, communication and other difficult issues for domestic packaging customers miserable, especially the market rules of shipping and difficult to return after the first payment of the Taiwan manufacturers insist, so familiar with the domestic purchase and sale the rules of the game, love packaging manufacturers from time to time dragged payment is not suitable.

These key sources of raw materials, the single situation of total dependence on imported packaging manufacturers, so in a very disadvantageous position in the price negotiations, although the fluorescent powder, silica gel and other domestic accessories price dropped lower and lower, but the key of the chip and the substrate price is always motionless, not with medium and small power source reduction mentioned in the same breath. Incoming high price and high rejection rate, making the mainland ceramic packaging light manufacturing cost and international companies than it is at a disadvantage, and consumers do not trust the reliability of products on the mainland, the brand does not agree, the promotion difficulty as can be imagined ceramic package source.

External package: EMC high-profile appearances, a unified, high power market trends

In addition to the above internal factors, in recent years turned out to be the EMC technology has caused the industry's market prospects for ceramic packaging doubt. In 2013, with the rapid growth of LED lighting demand, coupled with direct backlight L