Focus on the 2012 mainland LED lighting industry hot spots

2012, LED packaging field, enterprise competition and layout, the latest technology research and development trends, market price trends and other aspects will be the focus of attention of the entire LED industry direction.

Hot one: Mainland LED package by IPO shuffle

In 2012, power, LED packaging industry in the capital market, production capacity will be further released, increasing competitive pressure, first to be eliminated is the small packaging factory a number of technology and market is low.

At present, there are 1200-1500 packaging companies, with annual sales of 100 million yuan (below) the first camp of more than and 40, sales of 10 million yuan to 100 million yuan between the second camp enterprises less than 400, accounting for about 30%, most of the enterprise sales of less than 10 million yuan. This is the Taiwan package of eight listed companies with an average sales of 1 billion yuan far.

At the end of January 2012, the country star power, Lehman optoelectronics, REFOND, honglitronic, Mason technologies, Jufei, a 7 semiconductor package of listed companies, in February 1, 2012, the Commission released the 515 IPO total application in the list of enterprises, there are at least 9 LED companies are queuing up to be listed. According to statistics, currently actively engaged in equity system reform of LED enterprise in 40-60, including LED packaging companies, is expected in 2012 will be more related LED business impact IPO, listed at the end of trading LED industry stocks will be more than 20.

2012, the pattern of competition in the LED packaging industry will be launched in the first camp and the packaging of listed companies, some listed companies have quietly started the layout of cooperation, who is the main ups and downs? Will appear in 2013.

Hot two: 2012 LED packaging technology development trend of the top four

LED packaging technology is mainly to high luminous efficiency, high reliability, high heat capacity and thickness of four directions, the main highlights are: silicon LED, COB packaging technology, polycrystalline LED chip package, high voltage LED..

Silicon LED has attracted more and more attention, because it is better than the traditional LED sapphire substrate cooling capacity, so the power to do more, Cree will focus on the development of the silicon based LED, its main problem is that the yield is low, resulting in cost is high.

COB light source production cost is relatively low, the heat dissipation function is obvious, and has the characteristics of high packaging density and high optical density, easy to carry out personalized design, is one of the leading direction of future packaging development.

There is a decrease in COB optical lens multiple refraction caused by a loss of light, so in the light and heat energy efficiency increase remains to be improved, the substrate production yield also needs to be improved.

Complex LED chip packaging is one of the industry's goal to develop. Production of polycrystalline type chip is made simple shape and can avoid many complex processes, which significantly enhance the production feasibility, and back-end chip technology, collocation of eutectic solid crystal, which greatly simplifies the technical threshold of polycrystalline chip packaging, in driving the future of energy saving and carbon reduction, complex crystal chip the package is a good solution.

High voltage LED packaging is also a major focus. High pressure product is in a new thinking to solve the solid state lighting energy consumption caused by excess circuit problems, and thus help consumers reduce the purchase cost, the voltage in different regions under different operating conditions, can be used for fast and convenient.

Hot three: LED packaging product upgrades, the price is expected to gradually lower

2012, LED packaging products are mainly concentrated in the LED backlight and LED lighting two main battlefield. The mainstream LCD TV backlight specifications LED components market in 2012 will be a new specification (7030) are taking over. As in the lighting field, (5630) products in the price dropped to a certain range, the future application of the proportion in the LED lighting market will gradually increase, is expected to squeeze down (3014) and (3020) the application of LED packaging products in the lighting market.

A lot of standardization is the loss of the problem, and thus help end consumers to reduce the cost of purchase. At present, the TV backlight (5630) or about 4%, (7030) in the absence of production conditions, the average price seems not very competitive, but if a smooth production, is expected by the end of 2012 is expected to drop substantially; notebook computer (NB) makes the application of high brightness 0.8tLED rise, the largest decline of 8%; mobile phone part, as the specification gradually mature, so the price decline of about 5~6%; high power LED parts manufacturers are committed to promoting and clearing old product specifications, about overall average price decline of about 10%; as for LCD backlight products, has the brand factory import high current drive 3014 package, the use quantity can be reduced to about half of the LED; the backlight specifications (5630) and the price decline has been mature, more and more manufacturers to use lighting applications (5630) to produce LED tube or bulb, estimated in the first half of the 2012 price decline At around 10%.