Current status and Prospect of LED screen driver IC packaging

LED display after a long period of rapid development, is now widely used in finance, transportation, entertainment, sports and other areas of the display part. With the rapid development of the LED display, LED display "the" heart of the screen driver IC also experienced a long development period in addition to function improvement, increasing diversification and improving, the package also gradually miniaturization and serialization!

In a global perspective, LED screen driver IC more and more manufacturers, their products are more and more abundant, IC package also has diversified, SOP16, SOP, SSOP, TSSOP, PDIP, QFN and so on, to meet the market demand for all kinds of packaging. Currently on the market by the two SSOP-1.0mm package and SSOP-0.635mm package, these two kinds of package is not standard, it is a Japanese company (Toshiba Co) two kinds of non - standard package method. Because of its early circulation range, and the two is small than the standard package, suitable for wiring and other advantages, gradually occupy the dominant position in the market, the PCB board with the two kinds of packaging standard has gradually become the mainstream public board on the market.

As the screen driver IC, we can not talk about the accumulation and dyking, especially in mainland China, they occupy a large market share. It can be said that in the LED display driver IC, derived from TI and Toshiba, Xing in Taiwan dianjing and accumulate, they also use the SSOP-1.0mm and SSOP-0.635mm package, perhaps because of their growth, and the popularity of this two kinds of package, but also development of the mainland IC design in this field. Dianjing in product packaging do relatively complete covers almost all of the needs of the market, SOP, SSOP, TSSOP, PDIP, QFN and so on, which is worthy of our study

[1] [2] next page