China's great efforts to develop LED to bring huge business opportunities for Japanese companies?

China's Ministry of science and Technology issued the semiconductor lighting technology development in 12th Five-Year special plan proposed in 2015 to increase the domestic rate of LED chips to more than 80%, while its manufacturing costs fell to 1/5 in 2011. The government of Chinese semiconductor lighting project investment amounted to fifteen, 33 million yuan during the period of 11th Five-Year, 350 million yuan, 1 billion yuan during the 12th Five-Year plan, the goal is to make the Chinese LED lighting market size in 2015 expanded to 500 billion yuan.

Japanese companies consolidating their position in China

As mentioned above, China's LED lighting market is in the expansion phase, in this case, with a high level of technology in the world of Japanese companies have a lot of space to play a role. In the Chinese national semiconductor lighting engineering research and Industry Alliance (CSA) hosted the ninth Chinese International Semiconductor Lighting Forum "(9th China International Forum on Solid State (Lighting) from 5 to November 2012 7, Guangzhou), Japan LED related enterprises also showed a strong influence. Among them, in addition to the original on the China LED lighting industry has the influence of Nichia and CISCO became the sponsor of the Di, also for the first time to become a sponsor of ensequence. The level of sponsor only Nitto denko, Germany Ace, Royal PHILPS electronics company Holland three. B sponsor in addition to NVC (NVC) and nationstar, etc. China manufacturers, including CREE, EPISTAR, Seoul semiconductor, OSRAM and other 12 companies.

Other Japanese manufacturers, Hitachi chemical industry has set up a booth, and also joined in 2010 MITSUBISHI chemical China established "International Solid State Lighting (ISA)", has become a new member of the alliance. This, plus the original has become a member of the CISCO KANEKA, Nichia, Di, a total of 4 Japanese manufacturers joined the alliance. Japanese manufacturers and equipment manufacturers of these initiatives will promote China's LED industry leap.

Reduce the investment in the packaging process to 1/10

To sponsor the electrician a Nitto introduced in the future plans to expand sales of products, which focus on the publicity of the optical semiconductor element package film. The film has been adopted by many manufacturers in Japan, ensequence intended from the start in 2013 total sales in Chinese. The use of film technology, the product used in high brightness LED chip packaging can reduce manufacturing costs. Compared with the original bonding process, the thin film process can simplify the manufacturing process, and can be manufactured at 10 times the original speed. For each COB module package is equipped with 10 LED chip, the initial investment required ensequence to produce 1 million package amount as an example, the effect of publicity by the process. According to the company, the bonding process requires an investment of $9 million 360 thousand, while the thin film process is only 1/10 of its $900 thousand.

Hitachi Kasei exhibited a thin flexible substrate with low thermal resistance of the adhesive material. The substrate is pasted with a sheet material with adhesive material on the module base plate, which is helpful to realize the automation of the LED manufacturing process and reduce the number of processes and contribute to reducing the labor cost. There are a lot of Chinese companies interested in these shows.