Challenge the EMC package ceramic packaging market?

The attack yesterday "high power ceramic package domestic trouble and foreign invasion in an embarrassing situation? "One article mentioned that the mainland ceramic packaging industry seems to be in a state of worry outside the trapped and unable to extricate themselves. Is this really the case? The answer was No. In 2014, when the EMC package is hot, PPA/PCT package and no halt the advance also strive to occupy to EMC in high-profile accounted for stable 0.5W segments after 1W; feel more direct threat to the ceramic package practitioners did not sit in the premise of ensuring the advantages of high heat dissipation, high insulation, high reliability under the silently, to seek a breakthrough in technology, cost and market etc..

Hard work pays off, pay always return, by the end of 2014, a variety of good news followed, indicating that the spring of China's ceramic packaging industry is coming.

First, the advantages of ceramic packaging is obvious, high power density;

Talking about the development of ceramic packaging technology, we have to talk about the development trend of CREE. In 2014, CREE entered the Ronda, one hand is to cut the power in the market as soon as possible, on the other hand is to focus on the development of high power devices. CREE high power device development idea is "high density LED technology", is commonly known as high power, small size. The so-called high power refers to the same package size as much as possible to improve power and light efficiency, so that although the cost of a single package change is not large, but can significantly reduce the cost of system integration. The so-called small size is in the same flux under the premise as far as possible to reduce the package size, thereby reducing the cost of a single LED device, for example, from 3535 to 30302525, 1616 and 1010 until the chip level, which is gradually popular CSP technology.

Along with the concept of high power density, CREE has developed a variety of high density LED packaging devices suitable for outdoor lighting and indoor lighting applications. May 23, 2014, CREE launched XLamp XP-L LED, the industry's first to be able to achieve 200 mA current conditions in the light of the effect of 350 lm/W commercial production single chip high-power LED packaging devices. In December 18, 2014, CREE announced the XHP LED super power XLamp devices to achieve commercial production, LED on behalf of the XHP50 /70 device model XLamp LED device is the original of the same size, can realize the double lumen output and further enhance the reliability of LED devices, making the lighting manufacturers with more small quantity and more reliable can achieve the same brightness. To reduce the size and cost of lighting system.

If CREE ultra high power LED devices rely on its launch more in high power chip technology, so its recently launched a low cost high power XLamp MHD-E/G series is more reflected in its innovation in packaging technology. XLamp MHD-E/G series integrated ceramic of COB LED high lumen density / high reliability and surface mount structure design / manufacturing advantages, the high power chip collocation ceramic substrate of COB to achieve multi chip integration, high lumen output in a limited size, lighting customers Pro gaze surface mount technology provides COB performance. Compared to the homogenization of medium power LED devices, XLamp MHD-E/G series can simplify the development, improve the design flexibility, improve manufacturing efficiency, to help customers achieve a lighter lighting system costs more easily.

The smaller the cheaper the CSP technology is becoming a hot discussion in 2014. CSP technology is defined as the package volume is the same as the LED chip, or the packaging is not more than 20% LED chip, and functional integrity of the packaging components. In short, CSP technology in pursuit of the smaller volume reach the same light and efficiency, to achieve the purpose of low cost, small area of light and long life; at the same time, small volume also provides two times higher optical design flexibility, can be in the minimum unit area to achieve the highest brightness and luminous angle, provide lighting design flexibility the lamp, and lamp greatly, is expected to become one of the mainstream in the new generation of packaging technology.

Although the industry believes that CSP technology is not all the use of ceramic substrates, but now it seems that the current ceramic packaging is the most reliable and mature CSP technology program. As early as 2013, CREE launched its minimum lighting class LED devices XLamp XQ series, the package size is only 1.6 mm * mm, in the cold white light (5000 K), 1W conditions, can achieve up to 130 lm/W light efficiency. In January 2015, the country star power officially released the industry size ceramic based high power CSP devices NS-CSP minimum 1010 series, 3.5W reached the peak power, the size of only 1 x 1 x 0.4, light effect LED lighting market has great development potential.

Two, the rise of the mainland flip chip and ceramic substrate, material costs dropped significantly;

On the mainland ceramic packaging practitioners, if international companies such as CREE's achievements only reflect the industry prospects and technical target, so the rapid rise of the mainland flip chip and the ceramic substrate is reflected the reality of good.

Flip chip in the high current, high density, small size, large lumen and other aspects of the advantages of the chip is equipped with unparalleled advantages. As early as a few years ago, flip chip technology has been the industry's attention, but due to cost, technology and other reasons, resulting in the downstream terminal market remained quiet. In recent years, with the continuous improvement of technology, flip chip costs continue to decline, while further enhancing market acceptance. PHILPS, CREE is one of the early entry into the field of the manufacturers in Taiwan EPISTAR, canyuan, the new century is the development of similar products. Chip manufacturers, a few years ago also not resigned to playing second fiddle, only the flip chip"