CSP board LED public opinion is speculation or subversion?

If you have a conversation with Samsung, Toshiba, Jingyuan, Lunda, Seoul giants recently, or you participated in Guangya Exhibition, you will find that the last high-profile CSP package is not up, this year has been up on the booth and the media outlet, the giants are in the best of spirits in the technology and talk with eloquence, just like a fully equipped for attitude.

However, at this time, the industry has "no Shiqu" on the products will form CSP -- a pot of cold water as in the past several important packages, swept the market in the next few years, the development trend is very important, but in essence, the so-called innovative knowledge, still in the original promotion lm/$track, or simply to seize the other packaging market share, not to expand the industry living space, two did not reduce the pressure of competition in the industry, even if the implementation of 2500lm/$, but there is no egg in what.

So we have to talk about now is the fire CSP what to use, LED packaging industry has brought what, in lighting applications and what possibilities, whether it can play the role of subversion and open a new era of lighting.

What is CSP?

Although people in the industry may be aware of the definition of CSP, but all kinds of translation and argument vary, simply put, CSP (Chip Scale Package), translated into Chinese means chip size package, or chip level packaging. CSP is a memory chip package technology of the latest generation, the technology is mainly embodied in that the chip area and packaging area of more than 1:1.14, and very close to the ideal 1:1; relative to the LED industry, CSP package is based on flip chip technology and the CSP device refers to the packaging volume and flip chip volume control or to the same package size is not greater than 20% of the volume of the flip chip, there are three main types of structure (as shown below).

From the above definition can obtain several key features: 1, is about 1.2 times larger than the chip area or less; 2, no gold and bracket 3, currently only using flip chip technology to achieve; 4, technology and equipment for the production of high precision.

Where is the best?

1, effectively reduce the packaging volume, small, thin and light, to meet the current trend of LED lighting applications miniaturization, design and application more flexible, breaking the traditional light source size to the design constraints;

2, in the case of equal luminous flux, reduce the luminous surface can improve the optical density, the same device volume can provide greater power;

3, no gold, bracket, solid crystal glue, reduce intermediate links in the layer of heat resistant, high current, safety and reliability, especially more cost-effective. The cost advantage of this refers to the amount of postpartum, does not include the cost of research and development of early technical optimization

Where is the difficulty?

The production process of small size, high requirements of production equipment, precision and control the level of staff requirements increase, the price of production equipment determines the level of precision, the production yield and cost for the biggest consideration.

In the production process of the entire CSP, each process step, there are higher requirements on technology, equipment, personnel, and the following difficulties worth mentioning: the distance between the 1 control chip and the chip, the chip and the substrate; 2, the position of the matching degree of control; control 3, epitaxial chip wavelength range the uniformity of the control, 4; fluorescent powder thickness; 5, dispensing control technology; 6, sealing.

Who is working?

First look at the wafer level package (ie, chip size package) development background.

According to data compiled by IBTResearch show that the wafer level packaging technology based on flip chip, the first to start the development of IBM. In 1964, the United States IBM company in its M360 calculator first used FCOB solder bump flip chip device. 1969, the United States Delco company in the use of solder bump devices. In twentieth Century 70s, NEC, Hitachi and other Japanese companies began to use FCOB devices in some super calculator and calculator. In twentieth Century 90s, the world was established based on technology manufacturing companies such as KulickeandSoffa FlipChipDivision, Unitive FujitsuTohokuElectronics, s, ICInterconnect and many other wafer bumping process and have the solder plating process, these companies use bump technology and film distribution technology developed chip scale packaging technology. FCD and Fujitsu Corporation's super CSP (UltraCSP and SupperCSP) devices are the first to enter the market for chip size packaging products.

In 1999, wafer bumping manufacturing companies began issuing technical licenses to major packaging manufacturers. In this way, flip chip and chip size packaging will gradually spread around the world. For example, ASE and Siliconware companies in Taiwan and South Korea's Amkor company is in accordance with the company's FCD technology license to create super CSP (UltraCSP).

Therefore, the core technology of wafer level packaging is basically in the hands of a few companies, mainly used in the field of consumer IC packaging.

That is to say, CSP in the field of LED technology is still not mature, but the application in the IC industry for a long time, so, in the understanding of patents, in the LED industry need to determine whether CSP technology has been the IC industry patent covering CSP. According to the LED Industry Patent Alliance Engineer Zhang Yafei said that the current CSP patents more than 4000 (including LED related, including), for the CSP patent part, the subsequent GSC Jun will combine LED Industry Patent Alliance for specific interpretation.

Before we have reliable patent information