CHINASSL2012, LED technology trends

If technology is the engine of an industry, the market is the direction of the industry. In contrast, 2011-2012 LED industry, is experiencing a new round of integration of technology and market. As the global LED industry's top event -- the ninth China International Semiconductor Lighting Forum & Exhibition (CHINASSL2012) will watch the game industry focus, interpretation of the latest trend, showing the results of cutting-edge technology and design boutique.

"Packaging, for example, LED packaging in the whole industry chain plays a connecting role, but also China's LED in the global industrial division of labor has a scale and cost advantages of one of the links. "CHINASSL2012 committee responsible person said:" since 2011-2012, driven by market demand, package from the first line (LAMP), SMD package (SMD) to high power IC (High Power LED) and COB and other new forms of transition. "

COB packaging technology has again been widespread concern, the state of semiconductor light emitting devices (LED) application of product quality supervision and inspection center of the latest test report: Chinese has developed the input current COB package for 20mA light source and high light efficiency up to 177lm/W. LED, as always, refresh the record of technological innovation, which also marks the new breakthrough in the packaging LED links.

China International Semiconductor Lighting Forum and Exhibition (CHINASSL) as the world's top LED industry event, has been committed to the latest research and technological innovation and dissemination of communication. This year's CHINASSL2012 (November 5-7 day, Guangzhou) will launch 7 technical branches, concerned about the LED industry chain segments of the forefront of technological achievements.

Materials and equipment technology

We will focus on the two main factors that limit the performance improvement and cost reduction of semiconductor lighting products, focusing on the high quality epitaxial materials technology and excellent epitaxial equipment.

Thermal management and reliability technology

Mainly related to solid lighting components (including LEDs, optics, drive circuit, control, thermal design, etc.), as well as the reliability of integrated systems. Will include thermal design package, module and system of all levels, the new radiation method, the development of testing technology, accelerated test method and reliability model, modeling and simulation, testing standards and software development.

Chip, device, package and module technology

Focus on LED chip and devices to improve efficiency, reduce costs, improve yield, improve reliability and other key issues. There are some problems such as how to improve the consistency of wafer, reduce the loss of chip grading, and prevent the failure of high quality chip due to the lack of packaging materials and technology.

Drive, power supply and control technology

With the continuous improvement of LED lighting penetration and the decline in the cost of LED, LED drive and control technology has also grown rapidly from a weak link to be able to highlight the future of the important part of the interpretation of the light. This will be discussed from the aspects of multi drive technology, ultra high reliable drive technology, the original side constant current control technology, intelligent control technology and intelligent dimming technology.

LED products and lighting engineering design

With LED to improve the quality of light, has been possible with traditional light source meet as equals in the application. How to avoid weaknesses in the LED products and lighting engineering design, create the ideal light environment? How to protect the safety of biological, variable color, stepless dimming, fast ignition and make it easy to accept the intelligent control system, accelerate the standardization of? This series focus meeting will discuss.

LED lighting application quality

We will share with the international leading experts on the trend of LED lighting applications in the light of quality assessment, in the visual perception and cognitive, biophysical aspects of the latest recommendations on quality parameters and standardization issues. Includes but not limited to: LED lighting visual comfort / discomfort (such as glare, fatigue, light interference), optical properties, physiological rhythm, biological effects of light, lighting and LED lighting application standardization effect of sustainability. New lighting applications and lighting solutions will also be discussed.

OLED display and lighting

Organic light-emitting devices (OLED) have attracted wide attention in the application of high quality flat panel display and high performance solid state lighting. The world's top scientists and engineers will be invited to introduce the latest developments in the field of research and development, the broad prospects for the application of the new technology and the latest market trends.

During the meeting, CHINASSL2012 (Ninth China international semiconductor lighting exhibition and forum) domestic and foreign brands of enterprises, experts and scholars will be invited to discuss all aspects of the whole industry chain LED recent technology trends, products, market development situation and other content, invite you to pay attention to and participate in.