Supplying leading optical communication manufacturers, Leishen Technology launches listing guidance

According to the latest disclosure on the official website of the China Securities Regulatory Commission, Leishen Technology (Shenzhen) Co., Ltd. (hereinafter referred to as Leishen Technology) officially launched the listing counseling process on April 15, 2026. The coaching institution is Cathay Haitong Securities Co., Ltd., and has completed the counseling filing and registration with the Shenzhen Securities Regulatory Bureau.

Leishen Technology was established in October 2017 and is headquartered in Guangming District, Shenzhen. It is a service provider dedicated to providing professional precision equipment and systematic solutions for the optical communications and semiconductor industries.

In terms of main business, Leishen Technology’s current business is mainly divided into two major sectors. The first segment covers the R&D, production and sales of optical chip back-end precision equipment for chip-level and device-level testing, burn-in, SMT, optical path assembly and other aspects. Specific products include single-mode and multi-mode optical device coupling machines, low-power, medium-power and high-power COS test machines, burn-in test equipment, etc.

The second segment focuses on the research and development, production and sales of electronic chip back-end equipment, mainly precision chip placement machines and high-speed fully automatic ultrasonic thick aluminum wire bonding machines. The company's precision coupling equipment has occupied more than 50% of the domestic market, and has delivered more than 600 high-precision equipment in total, basically covering leading customers in the optical communications field.

Leishen Technology has chip-level, device-level and module-level packaging, coupling, and aging testing capabilities. It is one of the few companies in the domestic optical communication semiconductor field that has mastered the core technology of nanometer-level ultra-precision motion control platforms. Its products can meet the coupling requirements of 400G, 800G and even 1.6T optical modules, and are compatible with various technical solutions such as EML, silicon photonics, and thin film lithium niobate.

In terms of capital operation, Leishen Technology has received multiple rounds of financing support. Series A financing will be completed in May 2022, with investors including Shenzhen Hi-tech Investment, China Science and Technology Star, Yuanhe Puhua, Xixian Financial Holdings and other institutions. In January 2024, it completed nearly 100 million yuan in Series B financing, led by SMIC Juyuan, with participation from well-known institutions such as Waniu Capital and Shenzhen High-tech Investment. In June 2025, it completed hundreds of millions of yuan in Series C financing, led by China Venture Capital, followed by Electronic Control Industry Investment, Yangtze River Innovation Investment and Shenzhen Venture Capital. These financing funds are mainly used for team expansion, product line development and factory expansion and production.

Benefiting from the rapid development of artificial intelligence, data centers, and telecommunications industries, the market demand for optical modules continues to increase. As a professional equipment supplier in the optical communications and semiconductor industries, Leishen Technology has won widespread market recognition with its strong technical strength and in-depth customized services.

Quan Junming, chairman of Leishen Technology, once said that the development trend in the field of optical communications shows a dual track of going global and local substitution. The company is considering cooperating with customers to develop automated unmanned production lines, which will be successfully verified domestically before being replicated and promoted overseas.