With the development of Mini/Micro LED technology and the rise of the application trend of small-pitch products, LED packaging technology has also entered a new era of diversified development of COB, MiP, SMD, and COG.
Among them, MiP technology is a chip-level packaging technology. Its specific process is to transfer a large amount of Micro LED chips on the epitaxial wafer to the carrier board, and then directly package them, and then perform detection and light mixing after cutting. One of its major features is that it inherits the SMD manufacturing process and is well compatible with existing production equipment, reducing manufacturers' investment in heavy assets.
Therefore, many companies in the industry also regard MiP as a key technology for future LED packaging, and continue to increase their efforts to promote the development of MiP technology. Just recently, the latest developments in MiP technology have been frequently heard in the LED industry.
Xinying Optoelectronics and Almax reached strategic cooperation on MiP
On February 14, Hubei Xinying Optoelectronics Co., Ltd. and Hubei Aimaipu Optoelectronics Technology Co., Ltd. officially signed a MiP strategic cooperation agreement. The core of this strategic cooperation is to integrate the technical and resource advantages of both parties to promote the industrialization of Micro LED display technology.
It is reported that Xinying Optoelectronics and Amap have complementary advantages in Micro LED chip technology, chip-level packaging technology, mass transfer technology, and panel-level packaging technology. The two parties will work together to open up the entire industry chain of chips, packaging and applications, enhance product competitiveness, and accelerate the popularization of Micro LED display technology.
Through this cooperation, both parties will combine MiP packaging and panel technologies to give full play to their respective advantages, significantly improve the performance of display products and accelerate the industrialization process. The cooperation will focus on the Micro LED fine-pitch display market, such as high-end TVs, all-in-one machines, high-end cinemas and other application scenarios, and simultaneously expand high-end market application fields such as AR/VR and vehicle-mounted displays.
Xinying Optoelectronics revealed that the two parties are currently jointly developing the next generation revolutionary product AMiP, which integrates AM Micro IC and Micro LED into one package. The launch of AMiP will help the LED display screen to upgrade from passive drive to active drive, significantly improving the display quality.
Lipin releases the industry’s first silicon-based GaN unit
Core full color Micro LED chip LEKIN-SiMiP
On February 17, Suzhou Lijin Semiconductor Co., Ltd. announced the launch of the industry's first silicon-based GaN single-core integrated full-color Micro-LED chip - LEKIN-SiMiP, and cooperated with many display customers such as Huike to achieve verification of its application in micro-pitch LED large-screen direct display. This technology circumvents the problem of mass transfer and greatly improves the pass-through yield rate.
It is reported that Lishen Semiconductor has independently developed single-core full-color SiMiP display chip technology based on its own silicon-based GaN high-efficiency Micro-LED technology.
According to reports, SiMiP is a high-end MiP technology that uses a single-chip integration solution without the need for complicated mass transfer and repair processes, and the through-pass yield rate is significantly improved; through innovative technology routes, it reduces the complex links in the traditional process and avoids the use of toxic materials, which has more environmental advantages; the three primary color pixels of red, green and blue have a high degree of consistency in luminous wavelength, operating voltage and light distribution, which fundamentally solves the color shift problem of traditional solutions.
ISE 2025, a steady stream of new MiP technology products
At the European Audiovisual Technology and System Integration Exhibition that just ended in early February, MiP related technologies and new products appeared frequently and became one of the hot spots of this exhibition. For example, Alto Electronics launched the MiP series of commercial display screens. With the application of MiP technology, its contrast ratio reaches 10,000:1;
Nationstar Optoelectronics displays MiP series products for ultra-high-definition displays, including MiP-CIMD12, MiP-AIMD19, MiP-AIMD26 and other display device products, as well as MiP0606 modules, MiP0404 modules, MiP0303 modules and other display panel products;
Jingtai Optoelectronics has launched a new outdoor MiP1010 product, which has the characteristics of large thrust, large viewing angle, flip-chip design and universal design of common anode and anode.... The dynamics at the exhibition also represent the attitude and confidence of industry manufacturers in the future development of MiP technology.
With the help of corporate celebrities, MiP production capacity is gradually expanded
On the production side, MiP production capacity is also increasing. In November last year, Leyard announced that the company's full-process self-developed high-end MiP production line was officially put into mass production, and the yield rate of high-end MiP products produced by the production line was >95%.
It is reported that the production capacity of Leyard's first phase high-end MiP production line can reach 1200KK/month, and the production capacity of the second phase production line will be expanded to 2400KK/month in the future, further accelerating the process of cost reduction and efficiency improvement of Micro LED display products, bringing Micro LED products with higher cost performance and better display effects to the market, and greatly promoting the demand for ultra-fine pitch high-definition display below P1.0.
As a leading LED display company, Leyard has significantly expanded production in MiP technology, which has undoubtedly given a boost to the development of MiP technology.
In addition, more companies are entering the ranks of MiP production capacity. For example, in December last year, Sanan Optoelectronics’ wholly-owned subsidiary Aimaipu Optoelectronics stated that the company had realized Micro LED devices MiP0404 and MiP0202, as well as Micro LED display panels Mi
R&D and mass production of P0.78, MiP0.9 and other products, and has a MiP production capacity of 2000kk/month. It plans to expand the production capacity to 5000kk/month by the end of 2025.
Summary
MiP packaging technology is developing increasingly vigorously. In the short term in the future, MiP and COB technologies will gradually occupy various pitch application fields, driving the growth of the LED display market.
TrendForce predicts that as COB and MiP technologies continue to mature and the cost of ultra-fine-pitch LED displays declines, the LED display market is expected to maintain rapid growth. Among them, the market size of LED display screens below P2.5 will reach US$7.389 billion in 2027, with a compound growth rate of 12%, and the market size of LED display screens below P1.0 will reach US$1.145 billion in 2027, with a compound growth rate of 34%.
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