Light sub show: packaging and light source module 20 highlights

The twentieth Guangzhou International Lighting Exhibition ("exhibition") on the first day of the exhibition, for the packaging and light source module categories, GSC LED technical engineer Zhou Heng specially summarized this Guangya Exhibition twenty aspect, listed below, for reference:

First, the foreign packaging chip factory has introduced CSP and flip chip packaging;

Second, all domestic and foreign device products began to spell light source module assembly products, especially IC integrated products;

Third, EMC device product imitation integrated packaging mode made of high-power industrial lamps and floodlights;

Fourth, the light source module with IC integration of small power devices and single COB devices, according to different market use;

Fifth, the vehicle lamps and lanterns, all the lamps and lanterns have been shown to be modular;

Sixth, intelligent lighting solutions, home and business intelligence solutions;

Seventh, direct backlight, TV display products have CSP products;

Eighth, CSP packaging products imitation COB form, a combination of small devices and strings, according to the size of the application can be unlimited assembly;

Ninth, COB devices in the following 30W is still the mainstream market products;

Tenth, the integrated packaging device products in the 50W has a cost-effective advantage;

Eleventh, more and more applications of ultraviolet light, the penetration rate is also increasing;

Twelfth, plant lighting, mainly blue and red based;

Thirteenth, sapphire filament is still the main product to replace the old tungsten lamp;

Fourteenth, G9 is a small light dark horse;

Fifteenth, all manufacturers pay attention to adjustable light color products, the choice of power supply diversification;

Sixteenth, photoelectron billion 9595 new products, used in the bulb, and 2016 flash products, high angle 170 degrees;

Seventeenth, domestic and foreign COB device products more and more attention to high color rendering, color rendering index has been achieved by 95, as well as CITIZEN has launched 500W high power devices;

Eighteenth, integrated modular optical components in indoor lighting this piece, like the ceiling lamp, downlight, bulb lights, and outdoor lighting, such as lamps, cast light lamps, there is also a difference in the appearance of the structure, poor interoperability;

Nineteenth, flip chip chip R & D devices, mainly concentrated in a single 1W to 3W, basically using EMC stent;

Twentieth, small and high voltage device packaging products, mainly based on the 2835 and 3030, is still a hot market products.

For more information about LED, please click on China LED network or pay attention to WeChat public account (cnledw2013).